Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Switch FET bus switch Single supply TSSOP 8

1OE

GND

DCU PACKAGE

(TOP VIEW)

2OE

PW PACKAGE

(TOP VIEW)

1OE

GND

2OE

SN74CB3Q3306A

www.ti.com

SCDS113E –DECEMBER 2002–REVISED JANUARY 2011

Dual FET Bus Switch 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch

Check for Samples: SN74CB3Q3306A

FEATURES

• Data and Control Inputs Provide Undershoot

Clamp Diodes

• High-Bandwidth Data Path (up to 500 MHz

(1)

)

• Low Power Consumption (I

= 0.25 mA Typ)

• 5-V-Tolerant I/Os With Device Powered Up or

Powered Down • V

Operating Range From 2.3 V to 3.6 V

• Low and Flat ON-State Resistance (r

) • Data I/Os Support 0- to 5-V Signaling Levels

Characteristics Over Operating Range (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)

= 4 Ω Typ)

• Control Inputs Can Be Driven by TTL or

• Rail-to-Rail Switching on Data I/O Ports 5-V/3.3-V CMOS Outputs

– 0- to 5-V Switching With 3.3-V V

• I

off

Supports Partial-Power-Down Mode

Operation

– 0- to 3.3-V Switching With 2.5-V V

• Latch-Up Performance Exceeds 100 mA

• Bidirectional Data Flow With Near-Zero

Per JESD 78, Class II

Propagation Delay

• ESD Performance Tested Per JESD 22

• Low Input/Output Capacitance Minimizes

Loading and Signal Distortion – 2000-V Human-Body Model

io(OFF)

= 3.5 pF Typ) (A114-B, Class II)

• Fast Switching Frequency (f

= 20 MHz Max) – 1000-V Charged-Device Model (C101)

• Supports Both Digital and Analog

(1)

For additional information regarding the performance

characteristics of the CB3Q family, refer to the TI application

Applications: USB Interface, Differential Signal

report, CBT-C, CB3T, and CB3Q Signal-Switch Families,

Interface, Bus Isolation, Low-Distortion Signal

literature number SCDA008.

Gating

ORDERING INFORMATION

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

Tube SN74CB3Q3306APW

TSSOP – PW BU306A

Tape and reel SN74CB3Q3306APWR

–40°C to 85°C

SN74CB3Q3306ADCUR

US8-DCU Tape and reel GA6R

(2)

74CB3Q3306ADCURE4

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) The last character designates assembly/test site.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (15 pages)

PAGE 1
SN74CB3Q3306A www.ti.com SCDS113E – DECEMBER 2002 – REVISED JANUARY 2011 Dual FET Bus Switch 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch Check for Samples: SN74CB3Q3306A FEATURES • 1 • • • • • • • (1) (1) High-Bandwidth Data Path (up to 500 MHz ) 5-V-Tolerant I/Os With Device Powered Up or Powered Down Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 4 Ω Typ) Rail-to-Rail Switching on Data I/O Ports – 0- to 5-V Switching With 3.3-V VCC – 0- to 3.
PAGE 2
SN74CB3Q3306A SCDS113E – DECEMBER 2002 – REVISED JANUARY 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION/ORDERING INFORMATION The SN74CB3Q3306A is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron).
PAGE 3
SN74CB3Q3306A www.ti.com SCDS113E – DECEMBER 2002 – REVISED JANUARY 2011 SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) B A VCC Charge Pump EN(1) (1) EN is the internal enable signal applied to the switch. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range VIN Control input voltage range (2) (3) (2) (3) (4) MIN MAX –0.5 4.6 V –0.
PAGE 4
SN74CB3Q3306A SCDS113E – DECEMBER 2002 – REVISED JANUARY 2011 www.ti.com ELECTRICAL CHARACTERISTICS (1) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK MIN TYP (2) TEST CONDITIONS VCC = 3.6 V, II = –18 mA VCC = 3.6 V, VIN = 0 to 5.5 V VCC = 3.6 V, VO = 0 to 5.5 V, VI = 0, Switch OFF, VIN = VCC or GND Ioff VCC = 0, VO = 0 to 5.5 V, VI = 0 ICC VCC = 3.
PAGE 5
SN74CB3Q3306A www.ti.com SCDS113E – DECEMBER 2002 – REVISED JANUARY 2011 TYPICAL ron vs VI ron − ON-State Resistance − Ω 16 VCC = 3.3 V TA = 25°C IO = −15 mA 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 18 20 VI − V Figure 1. Typical ron vs VI TYPICAL ICC vs OE SWITCHING FREQUENCY 12 VCC = 3.3 V TA = 25°C A and B Ports Open ICC − mA 10 8 6 4 2 One OE Switching 0 0 2 4 6 8 10 12 14 16 OE Switching Frequency − MHz Figure 2.
PAGE 6
SN74CB3Q3306A SCDS113E – DECEMBER 2002 – REVISED JANUARY 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VCC Input Generator VI S1 RL VO 50 Ω 50 Ω VG2 RL CL (see Note A) TEST VCC S1 RL VI CL tpd(s) 2.5 V ± 0.2 V 3.3 V ± 0.3 V Open Open 500 Ω 500 Ω VCC or GND VCC or GND 30 pF 50 pF tPLZ/tPZL 2.5 V ± 0.2 V 3.3 V ± 0.3 V 2 × VCC 2 × VCC 500 Ω 500 Ω GND GND 30 pF 50 pF 0.15 V 0.3 V tPHZ/tPZH 2.5 V ± 0.2 V 3.3 V ± 0.
PAGE 7
SN74CB3Q3306A www.ti.com SCDS113E – DECEMBER 2002 – REVISED JANUARY 2011 REVISION HISTORY Changes from Revision D (April 2005) to Revision E • Page Added DCU package ordering information. ..........................................................................................................................
PAGE 8
PACKAGE OPTION ADDENDUM www.ti.
PAGE 9
PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device.
PAGE 10
PACKAGE MATERIALS INFORMATION www.ti.com 1-Nov-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74CB3Q3306ADCURG4 Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) US8 DCU 8 3000 180.0 SN74CB3Q3306ADCUR US8 DCU 8 3000 SN74CB3Q3306APWR TSSOP PW 8 2000 B0 (mm) K0 (mm) P1 (mm) 8.4 2.25 3.35 1.05 4.0 180.0 9.0 2.05 3.3 1.0 330.0 12.4 7.0 3.6 1.6 Pack Materials-Page 1 W Pin1 (mm) Quadrant 8.0 Q3 4.0 8.0 Q3 8.0 12.
PAGE 11
PACKAGE MATERIALS INFORMATION www.ti.com 1-Nov-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74CB3Q3306ADCURG4 US8 DCU 8 3000 202.0 201.0 28.0 SN74CB3Q3306ADCUR US8 DCU 8 3000 182.0 182.0 20.0 SN74CB3Q3306APWR TSSOP PW 8 2000 364.0 364.0 27.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.