Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Switch FET bus switch Single supply TSSOP 24

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   

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SCDS159B − OCTOBER 2003 − REVISED MARCH 2004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D Output Voltage Translation Tracks V

D Supports Mixed-Mode Signal Operation On

All Data I/O Ports

− 5-V Input Down To 3.3-V Output Level

Shift With 3.3-V V

− 5-V/3.3-V Input Down To 2.5-V Output

Level Shift With 2.5-V V

D 5-V-Tolerant I/Os With Device Powered-Up

or Powered-Down

D Bidirectional Data Flow, With Near-Zero

Propagation Delay

D Low ON-State Resistance (r

)

Characteristics (r

= 5 Ω Typical)

D Low Input/Output Capacitance Minimizes

Loading (C

io(OFF)

= 5 pF Typical)

D Data and Control Inputs Provide

Undershoot Clamp Diodes

D Low Power Consumption

= 40 µA Max)

D V

Operating Range From 2.3 V to 3.6 V

D Data I/Os Support 0 to 5-V Signaling Levels

(For Example: 0.8-V, 1.2-V, 1.5-V, 1.8-V,

2.5-V, 3.3-V, 5-V)

D Control Inputs Can Be Driven by TTL or

5-V/3.3-V/2.5-V CMOS Outputs

D I

off

Supports Partial-Power-Down Mode

Operation

D Latch-Up Performance Exceeds 250 mA Per

JESD 17

D ESD Performance Tested Per JESD 22

− 2000-V Human-Body Model

(A114-B, Class II)

− 1000-V Charged-Device Model (C101)

D Supports Digital Applications: Level

Translation, Memory Interleaving, Bus

Isolation

D Ideal for Low-Power Portable Equipment

DBQ, DGV, DW, OR PW PACKAGE

(TOP VIEW)

1OE

1B1

1A1

1A2

1B2

1B3

1A3

1A4

1B4

1B5

1A5

GND

2B5

2A5

2A4

2B4

2B3

2A3

2A2

2B2

2B1

2A1

2OE

description/ordering information

ORDERING INFORMATION

PACKAGE

†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

SOIC − DW

Tube SN74CB3T3384DW

CB3T3384

SOIC − DW

Tape and reel SN74CB3T3384DWR

CB3T3384

−40°C to 85°C

SSOP (QSOP) − DBQ Tape and reel SN74CB3T3384DBQR CB3T3384

−40

C to 85

TSSOP − PW

Tube SN74CB3T3384PW

KS384

TSSOP − PW

Tape and reel SN74CB3T3384PWR

KS384

TVSOP − DGV Tape and reel SN74CB3T3384DGVR

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Summary of content (19 pages)

PAGE 1
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004 D Output Voltage Translation Tracks VCC D Supports Mixed-Mode Signal Operation On D D D D D D D VCC Operating Range From 2.3 V to 3.6 V D Data I/Os Support 0 to 5-V Signaling Levels All Data I/O Ports − 5-V Input Down To 3.3-V Output Level Shift With 3.3-V VCC − 5-V/3.3-V Input Down To 2.5-V Output Level Shift With 2.
PAGE 2
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004 description/ordering information (continued) The SN74CB3T3384 is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks VCC. The SN74CB3T3384 supports systems using 5-V TTL, 3.
PAGE 3
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004 logic diagram (positive logic) 2 3 1A1 1B1 SW 10 11 1A5 1B5 SW 1 1OE 14 15 2A1 2B1 SW 22 23 2A5 SW 2B5 13 2OE simplified schematic, each FET switch (SW) † Gate Voltage (VG) is approximately equal to VCC + VT when the switch is ON and VI > VCC + VT. A B VG† Control Circuit EN‡ ‡ EN is the internal enable signal applied to the switch.
PAGE 4
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.
PAGE 5
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK VCC = 3 V, II = −18 mA VOH See Figures 3 and 4 IIN Control inputs TYP† VCC = 3.6 V, VIN = 3.6 V to 5.5 V or GND MAX UNIT −1.2 V ±10 µA ±20 VI = VCC − 0.7 V to 5.5 V VI = 0.7 V to VCC − 0.7 V VCC = 3.
PAGE 6
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004 switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2) PARAMETER tpd† ten FROM (INPUT) TO (OUTPUT) A or B B or A OE A or B VCC = 2.5 V ± 0.2 V MIN MAX VCC = 3.3 V ± 0.3 V MIN 0.15 1 10.5 1 UNIT MAX 0.25 ns 7.5 ns tdis OE A or B 1 6.
PAGE 7
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT Input Generator VI S1 RL VO 2 × VCC Open GND 50 Ω 50 Ω VG2 CL (see Note A) RL TEST VCC S1 RL VI CL V∆ tPLZ/tPZL 2.5 V ± 0.2 V 3.3 V ± 0.3 V 2 × VCC 2 × VCC 500 Ω 500 Ω GND GND 30 pF 50 pF 0.15 V 0.3 V tPHZ/tPZH 2.5 V ± 0.2 V 3.3 V ± 0.
PAGE 8
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE vs INPUT VOLTAGE OUTPUT VOLTAGE vs INPUT VOLTAGE 4.0 VCC = 2.3 V IO = 1 µA TA = 25°C 3.0 V − Output Voltage − V O V − Output Voltage − V O 4.0 2.0 1.0 0.0 VCC = 3 V IO = 1 µA TA = 25°C 3.0 2.0 1.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 1.0 VI − Input Voltage − V 2.0 Figure 3.
PAGE 9
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004 TYPICAL CHARACTERISTICS (continued) OUTPUT VOLTAGE HIGH vs SUPPLY VOLTAGE V − Output Voltage High − V OH 3.5 4.0 VCC = 2.3 V ~ 3.6 V VI = 5.5 V TA = 85°C 100 µA 8 mA 16 mA 24 mA 3.0 2.5 2.0 1.5 VCC = 2.3 V ~ 3.6 V VI = 5.5 V TA = 25°C 3.5 100 µA 8 mA 16 mA 24 mA 3.0 2.5 2.0 1.5 2.3 2.5 2.7 2.9 3.1 3.3 VCC − Supply Voltage − V 3.5 3.7 2.3 2.
PAGE 10
PACKAGE OPTION ADDENDUM www.ti.
PAGE 11
PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
PAGE 12
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74CB3T3384DBQR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DBQ 24 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74CB3T3384DWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 SN74CB3T3384PWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.
PAGE 13
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CB3T3384DBQR SSOP DBQ 24 2500 367.0 367.0 38.0 SN74CB3T3384DWR SOIC DW 24 2000 367.0 367.0 45.0 SN74CB3T3384PWR TSSOP PW 24 2000 367.0 367.0 38.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.