Datasheet

SN74CBT3125
QUADRUPLE FET BUS SWITCH
SCDS021I − MAY 1995 − REVISED SEPTEMBER 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D Standard ’125-Type Pinout (D, DB, DGV,
and PW Packages)
D 5-Ω Switch Connection Between Two Ports
D TTL-Compatible Input Levels
D, DB, DGV, OR PW PACKAGE
(TOP VIEW)
NC − No internal connection
DBQ PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
NC
1OE
1A
1B
2OE
2A
2B
GND
V
CC
4OE
4A
4B
3OE
3A
3B
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OE
1A
1B
2OE
2A
2B
GND
V
CC
4OE
4A
4B
3OE
3A
3B
RGY PACKAGE
(TOP VIEW)
114
78
2
3
4
5
6
13
12
11
10
9
4OE
4A
4B
3OE
3A
1A
1B
2OE
2A
2B
1OE
3B
V
GND
CC
description/ordering information
The SN74CBT3125 quadruple FET bus switch features independent line switches. Each switch is disabled
when the associated output-enable (OE
) input is high.
To ensure the high-impedance state during power up or power down, OE
should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
T
A
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN − RGY Tape and reel SN74CBT3125RGYR CU125
SOIC D
Tube SN74CBT3125D
CBT3125
SOIC − D
Tape and reel SN74CBT3125DR
CBT3125
−40°C to 85°C
SSOP − DB Tape and reel SN74CBT3125DBR CU125
40 C
to
85 C
SSOP (QSOP) − DBQ Tape and reel SN74CBT3125DBQR CU125
TSSOP − PW Tape and reel SN74CBT3125PWR CU125
TVSOP − DGV Tape and reel SN74CBT3125DGVR CU125
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
FUNCTION TABLE
(each bus switch)
INPUT
OE
FUNCTION
L A port = B port
H Disconnect
Copyright © 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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