Datasheet

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FEATURES

GND

DBVPACKAGE

(TOP VIEW)

A V

GND

Seemechanicaldrawingsfordimensions.

DCKPACKAGE

(TOP VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74CBTD1G384

SINGLE FET BUS SWITCH

WITH LEVEL SHIFTING

SCDS066K – JULY 1998 – REVISED JUNE 2006

• 5- Ω Switch Connection Between Two Ports • Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• TTL-Compatible Control Input Levels

The SN74CBTD1G384 features a single high-speed line switch. The switch is disabled when the output-enable

( OE) input is high. A diode to V

is integrated on the chip to allow for level shifting from 5-V signals at the

device inputs to 3.3-V signals at the device outputs.

ORDERING INFORMATION

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

(2)

Reel of 3000 SN74CBTD1G384DBVR

SOT (SOT-23) – DBV P8D_

Reel of 250 SN74CBTD1G384DBVT

–40 ° C to 85 ° C

Reel of 3000 SN74CBTD1G384DCKR

SOT (SC-70) – DCK P8_

Reel of 250 SN74CBTD1G384DCKT

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) The actual top-side marking has one additional character that designates the assembly/test site.

FUNCTION TABLE

INPUT

FUNCTION

L A port = B port

H Disconnect

LOGIC DIAGRAM (POSITIVE LOGIC)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (14 pages)

PAGE 1
SN74CBTD1G384 SINGLE FET BUS SWITCH WITH LEVEL SHIFTING www.ti.com SCDS066K – JULY 1998 – REVISED JUNE 2006 FEATURES • • • 5-Ω Switch Connection Between Two Ports TTL-Compatible Control Input Levels Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II DBV PACKAGE (TOP VIEW) A 1 B 2 GND 3 5 4 DCK PACKAGE (TOP VIEW) VCC A 1 B 2 GND 3 5 VCC 4 OE OE See mechanical drawings for dimensions.
PAGE 2
SN74CBTD1G384 SINGLE FET BUS SWITCH WITH LEVEL SHIFTING www.ti.com SCDS066K – JULY 1998 – REVISED JUNE 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.
PAGE 3
SN74CBTD1G384 SINGLE FET BUS SWITCH WITH LEVEL SHIFTING www.ti.com SCDS066K – JULY 1998 – REVISED JUNE 2006 Switching Characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) (1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd (1) A or B B or A ten OE A or B tdis OE A or B MIN MAX UNIT 0.25 ns 2 5.9 ns 1 4.
PAGE 4
SN74CBTD1G384 SINGLE FET BUS SWITCH WITH LEVEL SHIFTING www.ti.com SCDS066K – JULY 1998 – REVISED JUNE 2006 PARAMETER MEASUREMENT INFORMATION 500 W From Output Under Test S1 7V TEST Open GND CL = 50 pF (see Note A) S1 tpd tPLZ/tPZL tPHZ/tPZH Open 7V Open 500 W 3V Output Control (low-level enabling) LOAD CIRCUIT 1.5 V 0V tPZL 3V Input 1.5 V 1.5 V 0V tPLH 1.5 V 1.5 V tPZH VOH Output tPLZ 3.5 V Output Waveform 1 S1 at 7 V (see Note B) tPHL 1.
PAGE 5
SN74CBTD1G384 SINGLE FET BUS SWITCH WITH LEVEL SHIFTING www.ti.com SCDS066K – JULY 1998 – REVISED JUNE 2006 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE HIGH vs SUPPLY VOLTAGE OUTPUT VOLTAGE HIGH vs SUPPLY VOLTAGE 4 4 TA = 85°C TA = 0°C 3.75 100 mA 3.5 3.5 3.25 VOH - Output Voltage High - V 6 mA 12 mA 24 mA 3 2.75 2.5 2.25 2 1.75 1.5 4.5 100 mA 3.25 6 mA 12 mA 3 24 mA 2.75 2.5 2.25 2 1.75 4.75 5 5.25 5.5 1.5 4.5 5.75 4.75 5 5.25 5.5 5.
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PACKAGE OPTION ADDENDUM www.ti.
PAGE 7
PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PAGE 8
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) SN74CBTD1G384DBVR SOT-23 DBV 5 3000 178.0 9.0 SN74CBTD1G384DBVR SOT-23 DBV 5 3000 180.0 SN74CBTD1G384DBVT SOT-23 DBV 5 250 180.0 SN74CBTD1G384DCKR SC70 DCK 5 3000 SN74CBTD1G384DCKT SC70 DCK 5 250 3.23 3.17 1.37 4.0 8.0 Q3 8.4 3.23 3.17 1.
PAGE 9
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CBTD1G384DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74CBTD1G384DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 SN74CBTD1G384DBVT SOT-23 DBV 5 250 202.0 201.0 28.0 SN74CBTD1G384DCKR SC70 DCK 5 3000 202.0 201.0 28.0 SN74CBTD1G384DCKT SC70 DCK 5 250 202.0 201.0 28.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.