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SN54F240, SN74F240

OCTAL BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993

2–1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

• 3-State Outputs Drive Bus Lines or Buffer

Memory Address Registers

• Package Options Include Plastic

Small-Outline (SOIC) and Shrink

Small-Outline (SSOP) Packages, Ceramic

Chip Carriers, and Plastic and Ceramic

DIPs

description

These octal buffers and line drivers are designed

specifically to improve both the performance and

density of 3-state memory address drivers, clock

drivers, and bus-oriented receivers and

transmitters. Taken together with the ′F241 and

′F244, these devices provide the choice of

selected combinations of inverting and

noninverting outputs, symmetrical OE

(active-low

output-enable) inputs, and complementary OE

and OE

inputs.

The ′F240 is organized as two 4-bit buffers/line

drivers with separate output enable (OE

) inputs.

When OE

is low, the device passes data from the

A inputs to the Y outputs. When OE

is high, the

outputs are in the high-impedance state.

The SN74F240 is available in TI’s shrink

small-outline package (DB), which provides the

same I/O pin count and functionality of standard

small-outline packages in less than half the

printed-circuit-board area.

The SN54F240 is characterized for operation over

the full military temperature range of –55°C to

125°C. The SN74F240 is characterized for

operation from 0°C to 70°C.

FUNCTION TABLE

(each buffer)

INPUTS

OUTPUT

OE A

L H L

L LH

HXZ

1OE

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

SN54F240 ...J PACKAGE

SN74F240 . . . DB, DW, OR N PACKAGE

(TOP VIEW)

3212019

910111213

1Y1

2A4

1Y2

2A3

1Y3

1A2

2Y3

1A3

2Y2

1A4

SN54F240 . . . FK PACKAGE

(TOP VIEW)

2Y4

1A1

1OE

1Y4

2A2 2OE

2Y1

GND

2A1

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Summary of content (18 pages)

PAGE 1
SN54F240, SN74F240 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993 • SN54F240 . . . J PACKAGE SN74F240 . . .
PAGE 2
SN54F240, SN74F240 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993 logic symbol† 1OE 1A1 1A2 1A3 1A4 1 logic diagram (positive logic) 1 1OE EN 2 18 4 16 6 14 8 12 1Y1 2 18 4 16 1A1 1Y2 1Y3 1A2 14 1Y3 1A3 2OE EN 8 2A1 2A2 2A3 2A4 11 9 13 7 15 5 17 3 1Y2 1Y4 6 19 1Y1 12 1Y4 1A4 2Y1 2Y2 2Y3 19 2OE 2Y4 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
PAGE 3
SN54F240, SN74F240 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993 recommended operating conditions SN54F240 SN74F240 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL IIK Low-level input voltage 0.8 0.
PAGE 4
SN54F240, SN74F240 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993 switching characteristics (see Note 2) PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, CL = 50 pF, RL = 500 Ω, TA = 25°C VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX† ′F240 tPLH tPHL Any A Y tPZH tPZL OE Y tPHZ tPLZ OE Y SN54F240 SN74F240 MIN TYP MAX MIN MAX MIN 2.2 4.7 7 2.2 9 2.2 8 1.2 3.1 4.7 1.2 6 1.2 5.7 1.2 3.1 5.3 1.2 6.7 1.2 6.
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PACKAGE OPTION ADDENDUM www.ti.
PAGE 6
PACKAGE OPTION ADDENDUM www.ti.
PAGE 7
PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PAGE 8
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74F240DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74F240DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74F240NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.
PAGE 9
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F240DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74F240DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74F240NSR SO NS 20 2000 367.0 367.0 45.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
PAGE 18
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.