Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Buffer, driver SOIC 20







SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993

2−1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443

• 3-State Outputs Drive Bus Lines or Buffer

Memory Address Registers

• Package Options Include Plastic

Small-Outline (SOIC) and Shrink

Small-Outline (SSOP) Packages, Ceramic

Chip Carriers, and Plastic and Ceramic

DIPs

description

These octal buffers and line drivers are designed

specifically to improve both the performance and

density of 3-state memory address drivers, clock

drivers, and bus-oriented receivers and

transmitters. Taken together with the ′F240 and

′F241, these devices provide the choice of

selected combinations of inverting and

noninverting outputs, symmetrical OE

(active-low

output-enable) inputs, and complementary OE

and OE

inputs.

The ′F244 is organized as two 4-bit buffers/line

drivers with separate output enable (OE

) inputs.

When OE

is low, the device passes data from the

A inputs to the Y outputs. When OE

is high, the

outputs are in the high-impedance state.

The SN74F244 is available in TI’s shrink

small-outline package (DB), which provides the

same I/O pin count and functionality of standard

small-outline packages in less than half the

printed-circuit-board area.

The SN54F244 is characterized for operation over

the full military temperature range of −55°C to

125°C. The SN74F244 is characterized for

operation from 0°C to 70°C.

FUNCTION TABLE

(each buffer)

INPUTS

OUTPUT

OE A

OUTPUT

L H H

L LL

H X Z

1OE

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

SN54F244 ...J PACKAGE

SN74F244 . . . DB, DW, OR N PACKAGE

(TOP VIEW)

3 2 1 20 19

9 10 11 12 13

1Y1

2A4

1Y2

2A3

1Y3

1A2

2Y3

1A3

2Y2

1A4

SN54F244 . . . FK PACKAGE

(TOP VIEW)

2Y4

1A1

1OE

1Y4

2A2 2OE

2Y1

2A1

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Summary of content (20 pages)

PAGE 1
SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993 • SN54F244 . . . J PACKAGE SN74F244 . . .
PAGE 2
SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993 logic symbol† 1OE 1A1 1A2 1A3 1A4 1 logic diagram (positive logic) 1OE 1 EN 2 18 4 16 6 14 8 12 1A1 1Y1 2 18 4 16 1Y2 1Y3 1A2 6 2OE EN 14 1Y3 8 12 1A4 2A1 2A2 2A3 2A4 11 9 13 7 15 5 17 3 1Y2 1Y4 1A3 19 1Y1 1Y4 2Y1 2Y2 19 2OE 2Y3 2Y4 11 9 13 7 15 5 17 3 2Y1 2A1 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
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SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993 recommended operating conditions SN54F244 SN74F244 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL IIK Low-level input voltage 0.8 0.
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SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993 switching characteristics (see Note 2) PARAMETER FROM (INPUT) VCC = 5 V, CL = 50 pF, RL = 500 Ω, TA = 25°C TO (OUTPUT) VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX† ′F244 tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y SN74F244 MIN TYP MAX MIN MAX MIN MAX 1.7 3.6 5.2 2 6.5 1.7 6.2 1.7 3.6 5.2 2 7 1.7 6.5 1.2 3.9 5.7 2 7 1.2 6.7 1.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 22-Jun-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74F244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74F244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74F244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 22-Jun-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F244DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74F244DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74F244DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74F244NSR SO NS 20 2000 367.0 367.0 45.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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