Datasheet

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SN54F245, SN74F245

OCTAL BUS TRANSCEIVERS

WITH 3-STATE OUTPUTS

SDFS010A – MARCH 1987 – REVISED OCTOBER 1993

2–1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

• 3-State Outputs Drive Bus Lines Directly

• Package Options Include Plastic

Small-Outline (SOIC) and Shrink

Small-Outline (SSOP) Packages, Ceramic

Chip Carriers, and Plastic and Ceramic

DIPs

description

These octal bus transceivers are designed for

asynchronous communication between data

buses. The devices transmit data from the A bus

to the B bus or from the B bus to the A bus

depending upon the logic level at the

direction-control (DIR) input. The output enable

(OE

) input can be used to disable the device so the

buses are effectively isolated.

The SN74F245 is available in TI’s shrink

small-outline package (DB), which provides the

same I/O pin count and functionality of standard

small-outline packages in less than half the

printed-circuit-board area.

The SN54F245 is characterized for operation over

the full military temperature range of –55°C to

125°C. The SN74F245 is characterized for

operation from 0°C to 70°C.

FUNCTION TABLE

INPUTS

OPERATION

OE DIR

OPERATION

L L B data to A bus

L H A data to B bus

H X Isolation

DIR

GND

SN54F245 ...J PACKAGE

SN74F245 . . . DB, DW, OR N PACKAGE

(TOP VIEW)

3212019

910 11 12 13

DIR

B6 OE

GND

SN54F245 . . . FK PACKAGE

(TOP VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Summary of content (18 pages)

PAGE 1
SN54F245, SN74F245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SDFS010A – MARCH 1987 – REVISED OCTOBER 1993 SN54F245 . . . J PACKAGE SN74F245 . . . DB, DW, OR N PACKAGE (TOP VIEW) 3-State Outputs Drive Bus Lines Directly Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs DIR A1 A2 A3 A4 A5 A6 A7 A8 GND description These octal bus transceivers are designed for asynchronous communication between data buses.
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SN54F245, SN74F245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SDFS010A – MARCH 1987 – REVISED OCTOBER 1993 logic symbol† OE DIR A1 19 1 2 logic diagram (positive logic) DIR G3 1 3EN1[BA] 3EN2[AB] 19 18 1 B1 A1 OE 2 2 A2 A3 A4 A5 A6 A7 A8 3 17 4 16 5 15 6 14 7 13 8 12 9 11 B2 18 B3 B1 B4 B5 B6 B7 To Seven Other Channels B8 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
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SN54F245, SN74F245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SDFS010A – MARCH 1987 – REVISED OCTOBER 1993 recommended operating conditions SN54F245 VCC VIH Supply voltage VIL IIK Low-level input voltage IOH High level output current High-level IOL Low level output current Low-level TA Operating free-air temperature High-level input voltage SN74F245 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 2 2 UNIT V V 0.8 0.
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SN54F245, SN74F245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SDFS010A – MARCH 1987 – REVISED OCTOBER 1993 switching characteristics (see Note 2) PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, CL = 50 pF, RL = 500 Ω, TA = 25°C VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX† ′F245 tPLH tPHL A or B B or A tPZH tPZL OE A or B tPHZ tPLZ OE A or B SN54F245 SN74F245 MIN TYP MAX MIN MAX MIN MAX 1.7 3.8 6 1.2 7.5 1.7 7 1.7 4.2 6 1.2 7.5 1.7 7 2.2 4.9 7 1.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.
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PACKAGE MATERIALS INFORMATION www.ti.com 3-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74F245DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74F245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74F245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 3-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F245DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74F245DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74F245DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74F245NSR SO NS 20 2000 367.0 367.0 45.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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