Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Flip-Flop Standard Three-state, Non-inverting SOIC 20

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SDFS077A − D2932, MARCH 1987 − REVISED OCTOBER 1993

2−1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

• Eight D-Type Flip-Flops in a Single Package

• 3-State Bus-Driving True Outputs

• Full Parallel Access for Loading

• Buffered Control Inputs

• Package Options Include Plastic

Small-Outline (SOIC) and Shrink

Small-Outline (SSOP) Packages, Ceramic

Chip Carriers, and Plastic and Ceramic

DIPs

description

These 8-bit flip-flops feature 3-state outputs

designed specifically for driving highly capacitive

or relatively low-impedance loads. They are

particularly suitable for implementing buffer

registers, I/O ports, bidirectional bus drivers, and

working registers.

The eight flip-flops of the ′F374 are edge-triggered

D-type flip-flops. On the positive transition of the

clock (CLK) input, the Q outputs are set to the logic

levels that were set up at the data (D) inputs.

A buffered output enable (OE

) input can be used

to place the eight outputs in either a normal logic

state (high or low) or a high-impedance state. In

the high-impedance state, the outputs neither

load nor drive the bus lines significantly. The

high-impedance state and the increased drive

provide the capability to drive bus lines without

need for interface or pullup components.

The output enable (OE

) input does not affect internal operations of the flip-flop. Old data can be retained or new

data can be entered while the outputs are in the high-impedance state.

The SN74F374 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count

and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F374 is characterized for operation over the full military temperature range of −55°C to 125°C. The

SN74F374 is characterized for operation from 0°C to 70°C.

FUNCTION TABLE

(each flip-flop)

INPUTS

OUTPUT

OE CLK D

OUTPUT

L ↑ H H

L ↑ LL

L H or L X Q

H X X Z

GND

CLK

SN54F374 ...J PACKAGE

SN74F374 ... DB, DW, OR N PACKAGE

(TOP VIEW)

3 2 1 20 19

9 10 11 12 13

SN54F374 . . . FK PACKAGE

(TOP VIEW)

CLK

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Summary of content (20 pages)

PAGE 1
SDFS077A − D2932, MARCH 1987 − REVISED OCTOBER 1993 SN54F374 . . . J PACKAGE SN74F374 . . .
PAGE 2
SDFS077A − D2932, MARCH 1987 − REVISED OCTOBER 1993 logic symbol† OE CLK 1 11 logic diagram (positive logic) OE EN C1 CLK 1 11 C1 1D 2D 3D 4D 5D 6D 7D 8D 3 2 1D 4 5 7 6 8 9 13 12 14 15 17 16 18 19 1Q 1D 3 2 1Q 1D 2Q 3Q 4Q 5Q To Seven Other Channels 6Q 7Q 8Q † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
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SDFS077A − D2932, MARCH 1987 − REVISED OCTOBER 1993 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH SN54F374 TYP† MAX TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V VCC = 4.75 V, MIN II = − 18 mA IOH = − 1 mA −1.2 IOH = − 3 mA IOH = − 1 mA to − 3 mA VOL VCC = 4.5 V IOL = 20 mA IOL = 24 mA IOZH IOZL VCC = 5.5 V, VCC = 5.5 V, VO = 2.7 V VO = 0.
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SDFS077A − D2932, MARCH 1987 − REVISED OCTOBER 1993 switching characteristics (see Note 3) PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, CL = 50 pF, RL = 500 Ω, TA = 25°C VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX† ′F374 MIN fmax tPLH TYP MAX 100 UNIT SN54F374 SN74F374 MIN MIN MAX 60 MAX 70 MHz 3.2 6.1 8.5 3.2 10.5 3.2 10 3.2 6.1 8.5 3.2 11 3.2 10 1.2 8.6 11.5 1.2 14 1.2 12.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74F374DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74F374DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74F374NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F374DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74F374DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74F374NSR SO NS 20 2000 367.0 367.0 45.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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