Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Inverter Inverter 74HC SOIC 14

GND

SN74HC14 . . . D, DB, N, NS, OR PW PACKAGE

(TOP VIEW)

3 2 1 20 19

9 10 11 12 13

GND

SN54HC14 . . . FK PACKAGE

(TOP VIEW)

NC − No internal connection

SN54HC14 . . . J OR W PACKAGE

SN54HC14, SN74HC14

www.ti.com

SCLS085G –DECEMBER 1982–REVISED JANUARY 2014

SNx4HC14 Hex Schmitt-Trigger Inverters

Check for Samples: SN54HC14, SN74HC14

FEATURES

DESCRIPTION

These Schmitt-trigger devices contain six

• Wide Operating Voltage Range of 2 V to 6 V

independent inverters. They perform the Boolean

• Outputs Can Drive Up to 10 LSTTL Loads

function Y = A in positive logic.

• Low Power Consumption, 20-μA Max I

• Typical t

= 11 ns

• ±4-mA Output Drive at 5 V

• Low Input Current of 1 μA Max

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (20 pages)

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SN54HC14, SN74HC14 www.ti.com SCLS085G – DECEMBER 1982 – REVISED JANUARY 2014 SNx4HC14 Hex Schmitt-Trigger Inverters Check for Samples: SN54HC14, SN74HC14 FEATURES DESCRIPTION • • • • • • These Schmitt-trigger devices contain six independent inverters. They perform the Boolean function Y = A in positive logic.
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SN54HC14, SN74HC14 SCLS085G – DECEMBER 1982 – REVISED JANUARY 2014 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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SN54HC14, SN74HC14 www.ti.com SCLS085G – DECEMBER 1982 – REVISED JANUARY 2014 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VT+ VT− VT+ − VT− IOH = –20 μA VOH VI = VIH or VIL IOH = –4 mA IOH = –5.2 mA IOL = 20 μA VOL VI = VIH or VIL IOL = 4 mA IOL = 5.2 mA II VI = VCC or 0 ICC VI = VCC or 0, IO = 0 TA = 25°C MIN TYP SN54HC14 MAX SN74HC14 MAX MIN 2V 0.7 1.2 1.5 0.7 1.5 0.7 1.5 1.55 2.5 3.15 1.
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SN54HC14, SN74HC14 SCLS085G – DECEMBER 1982 – REVISED JANUARY 2014 www.ti.
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SN54HC14, SN74HC14 www.ti.com SCLS085G – DECEMBER 1982 – REVISED JANUARY 2014 REVISION HISTORY Changes from Revision F (December 2010) to Revision G Page • Updated document to new TI datasheet format - no specification changes. ....................................................................... 1 • Added ESD warning. ............................................................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 27-Jan-2014 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line.
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PACKAGE MATERIALS INFORMATION www.ti.com 27-Jan-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC14DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74HC14DR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 SN74HC14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 27-Jan-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC14DBR SSOP DB 14 2000 367.0 367.0 38.0 SN74HC14DR SOIC D 14 2500 364.0 364.0 27.0 SN74HC14DR SOIC D 14 2500 333.2 345.9 28.6 SN74HC14DR SOIC D 14 2500 385.0 388.0 194.0 SN74HC14DRG3 SOIC D 14 2500 364.0 364.0 27.0 SN74HC14DRG4 SOIC D 14 2500 333.2 345.9 28.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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