Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Buffer, driver PDIP 16

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SCLS308D − JANUARY 1996 − REVISED OCTOBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D Wide Operating Voltage Range of 2 V to 6 V

D High-Current 3-State Outputs Drive Bus

Lines, Buffer-Memory Address Registers,

or Drive Up To 15 LSTTL Loads

D True Outputs

D Low Power Consumption, 80-µA Max I

D Typical t

= 10 ns

D ±6-mA Output Drive at 5 V

D Low Input Current of 1 µA Max

description/ordering information

These hex buffers and line drivers are designed

specifically to improve both the performance and

density of 3-state memory address drivers, clock

drivers, and bus-oriented receivers and

transmitters. The ’HC365 devices contain six

independent buffers/drivers with dual-gated

output-enable (OE1

and OE2) inputs. When OE1

and OE2 are both low, the devices pass

noninverted data from the A inputs to the

Y outputs. If either (or both) output-enable

terminal(s) is high, the outputs are in the

high-impedance state.

ORDERING INFORMATION

PACKAGE

†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

PDIP − N Tube of 25 SN74HC365N SN74HC365N

Tube of 40 SN74HC365D

SOIC − D

Reel of 2500 SN74HC365DR

HC365

−40°C to 85°C

SOIC − D

Reel of 250 SN74HC365DT

HC365

−40°C to 85°C

SOP − NS Reel of 2000 SN74HC365NSR HC365

Reel of 90 SN74HC365PW

TSSOP − PW

Reel of 2000 SN74HC365PWR

HC365

TSSOP − PW

Reel of 250 SN74HC365PWT

HC365

CDIP − J Tube of 25 SNJ54HC365J SNJ54HC365J

−55°C to 125°C

CFP − W Tube of 150 SNJ54HC365W SNJ54HC365W

−55 C to 125 C

LCCC − FK Tube of 55 SNJ54HC365FK SNJ54HC365FK

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

3212019

910111213

OE1

OE2

GND

SN54HC365 . . . FK PACKAGE

(TOP VIEW)

NC − No internal connection

OE1

GND

OE2

SN54HC365 ...J OR W PACKAGE

SN74HC365 . . . D, N, NS, OR PW PACKAGE

(TOP VIEW)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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Summary of content (19 pages)

PAGE 1
SCLS308D − JANUARY 1996 − REVISED OCTOBER 2003 D Wide Operating Voltage Range of 2 V to 6 V D High-Current 3-State Outputs Drive Bus D D D D D Lines, Buffer-Memory Address Registers, or Drive Up To 15 LSTTL Loads True Outputs Low Power Consumption, 80-µA Max ICC Typical tpd = 10 ns ±6-mA Output Drive at 5 V Low Input Current of 1 µA Max SN54HC365 . . . J OR W PACKAGE SN74HC365 . . .
PAGE 2
SCLS308D − JANUARY 1996 − REVISED OCTOBER 2003 FUNCTION TABLE (each buffer/driver) INPUTS OE1 OE2 A OUTPUT Y H X X Z X H X Z L L H H L L L L logic diagram (positive logic) OE1 OE2 A1 1 15 2 3 Y1 To Five Other Channels Pin numbers shown are for the D, J, N, NS, PW, and W packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . .
PAGE 3
SCLS308D − JANUARY 1996 − REVISED OCTOBER 2003 recommended operating conditions (see Note 3) SN54HC365 VCC VIH Supply voltage VCC = 2 V VCC = 4.5 V High-level input voltage VCC = 6 V VCC = 2 V VIL VI VO ∆t/∆v MIN NOM MAX 2 5 6 Input voltage MAX 2 5 6 3.15 3.15 4.2 4.2 0 VCC = 6 V UNIT V V 0.5 0.5 1.35 1.35 1.8 1.8 VCC VCC VCC = 2 V VCC = 4.5 V Input transition rise/fall time NOM 1.
PAGE 4
SCLS308D − JANUARY 1996 − REVISED OCTOBER 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) TA = 25°C TYP MAX SN54HC365 SN74HC365 PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V 50 95 145 120 tpd A Y 4.5 V 12 19 29 24 6V 10 16 25 20 ten OE tdis OE tt Y Y Any MIN MIN MAX MIN MAX 2V 100 190 285 238 4.
PAGE 5
SCLS308D − JANUARY 1996 − REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION VCC PARAMETER Test Point From Output Under Test S1 ten RL CL (see Note A) RL tPZH tdis S2 tPZL tPHZ tPLZ 1 kΩ 1 kΩ −− tpd or tt LOAD CIRCUIT CL S1 S2 50 pF or 150 pF Open Closed Closed Open Open Closed Closed Open Open Open 50 pF 50 pF or 150 pF VCC Input 50% 50% 0V tPLH In-Phase Output 50% 10% tPHL 90% VOH 50% 10% V OL tf 90
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PAGE 9
PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC365DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74HC365PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC365PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC365DR SOIC D 16 2500 333.2 345.9 28.6 SN74HC365PWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74HC365PWT TSSOP PW 16 250 367.0 367.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.