Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Buffer, driver 74HCT244 PDIP 20

1A1

1A2

1A3

1A4

1Y1

2A1

2A2

2A3

2A4

2Y1

1Y2

1Y3

1Y4

2Y2

2Y3

2Y4

2OE

1OE

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

On products compliant to MIL-PRF-38535, all parameters are

tested unless otherwise noted. On all other products, production

processing does not necessarily include testing of all parameters.

SN54HCT244

SN74HCT244

SCLS175E –MONTH 2003–REVISED AUGUST 2016

SNx4HCT244 Octal Buffers and Line Drivers With 3-State Outputs

1 Features

• Operating Voltage Range of 4.5 V to 5.5 V

• High-Current Outputs Drive up to 15 LSTTL Loads

• Low Power Consumption: 80-µA Maximum I

• Typical t

= 13 ns

• ±6-mA Output Drive at 5 V

• Low Input Current of 1 µA Maximum

• Inputs Are TTL-Voltage Compatible

• 3-State Outputs Drive Bus Lines and Buffer

Memory Address Registers

2 Applications

• Servers

• LED Displays

• Network Switches

• Telecom Infrastructure

• Motor Drivers

• I/O Expanders

3 Description

These octal buffers and line drivers are designed

specifically to improve both the performance and

density of 3-state memory address drivers,

clockdrivers, and bus-oriented receivers and

transmitters. The SNx4HCT244 devices are

organized as two 4-bit buffers or drivers with separate

output-enable (OE) inputs. When OE is low, the

device passes noninverted data from the A inputs to

the Y outputs. When OE is high, the outputs are in

the high-impedance state.

Device Information

(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

SN74HCT244DB SSOP (20) 7.20 mm × 5.30 mm

SN74HCT244DW SOIC (20) 12.80 mm × 7.50 mm

SN74HCT244N PDIP (20) 24.33 mm × 6.35 mm

SN74HCT244NS SO (20) 12.60 mm × 5.30 mm

SN74HCT244PW TSSOP (20) 6.50 mm × 4.40 mm

SN54HCT244

CDIP (20) 24.20 mm × 6.92 mm

LCCC (20) 8.89 mm × 8.89 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Logic Diagram (Positive Logic)

Summary of content (30 pages)

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Product Folder Sample & Buy Support & Community Tools & Software Technical Documents SN54HCT244, SN74HCT244 SCLS175E – MONTH 2003 – REVISED AUGUST 2016 SNx4HCT244 Octal Buffers and Line Drivers With 3-State Outputs 1 Features 3 Description • • • • • • • • These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clockdrivers, and bus-oriented receivers and transmitters.
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SN54HCT244, SN74HCT244 SCLS175E – MONTH 2003 – REVISED AUGUST 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications...............................
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SN54HCT244, SN74HCT244 www.ti.
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SN54HCT244, SN74HCT244 SCLS175E – MONTH 2003 – REVISED AUGUST 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) VCC Supply voltage (2) MIN MAX UNIT –0.
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SN54HCT244, SN74HCT244 www.ti.com SCLS175E – MONTH 2003 – REVISED AUGUST 2016 6.4 Thermal Information SN74HCT244 THERMAL METRIC (1) DB (SSOP) DW (SOIC) N (PDIP) NS (SO) PW (TSSOP) 20 PINS 20 PINS 20 PINS 20 PINS 20 PINS UNIT RθJA Junction-to-ambient thermal resistance 89.4 76.6 44.8 71.8 97.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 50.8 42.1 30.9 38.1 32.5 °C/W RθJB Junction-to-board thermal resistance 44.5 44.5 25.7 39.2 49.
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SN54HCT244, SN74HCT244 SCLS175E – MONTH 2003 – REVISED AUGUST 2016 www.ti.com 6.6 Switching Characteristics: CL = 50 pF over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 2 ) PARAMETER FROM (INPUT) TO (OUTPUT) VCC TEST CONDITIONS MIN TA = 25°C 4.5 V tpd A Y ten OE 15 28 42 SN74HCT244 35 13 25 SN54HCT244 38 SN74HCT244 32 TA = 25°C 4.5 V MAX SN54HCT244 TA = 25°C 5.5 V TYP 21 53 44 TA = 25°C 5.
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SN54HCT244, SN74HCT244 www.ti.com SCLS175E – MONTH 2003 – REVISED AUGUST 2016 Switching Characteristics: CL = 150 pF (continued) over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 2) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCC MIN TYP MAX 17 42 TA = 25°C 4.5 V tt Y SN54HCT244 63 SN74HCT244 53 TA = 25°C 5.5 V 14 UNIT ns 38 SN54HCT244 57 SN74HCT244 48 6.
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SN54HCT244, SN74HCT244 SCLS175E – MONTH 2003 – REVISED AUGUST 2016 www.ti.com 7 Parameter Measurement Information VCC From Output Under Test CL (see Note A) PARAMETER S1 Test Point tPZH ten RL 1 kΩ tPZL tPHZ tdis S2 RL tPLZ –– LOAD CIRCUIT 2.7 V 2.7 V S1 S2 50 pF or 150 pF Open Closed Closed Open 50 pF 1 kΩ tpd or tt Input 1.3 V 0.3 V CL 50 pF or 150 pF Open Closed Closed Open Open Open 3V 1.3 V 0.3 V 0 V tr tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES 3V Input 1.
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SN54HCT244, SN74HCT244 www.ti.com SCLS175E – MONTH 2003 – REVISED AUGUST 2016 8 Detailed Description 8.1 Overview The SNx4HCT244 device is organized as two 4-bit buffers and line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
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SN54HCT244, SN74HCT244 SCLS175E – MONTH 2003 – REVISED AUGUST 2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.
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SN54HCT244, SN74HCT244 www.ti.com SCLS175E – MONTH 2003 – REVISED AUGUST 2016 Typical Application (continued) 9.2.3 Application Curve 22 tpd (ns) 21 20 19 18 17 4.5 4.7 4.9 5.1 5.3 VCC (V) 5.5 C001 Figure 5. Propagation Delay vs VCC 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in Recommended Operating Conditions. Each VCC terminal must have a good bypass capacitor to prevent power disturbance.
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SN54HCT244, SN74HCT244 SCLS175E – MONTH 2003 – REVISED AUGUST 2016 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation, see the following: Implications of Slow or Floating CMOS Inputs (SCBA004) 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HCT244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74HCT244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74HCT244NSR SO NS 20 2000 330.0 24.4 9.0 13.0 2.4 12.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HCT244DBR SN74HCT244DWR SSOP DB 20 2000 367.0 367.0 38.0 SOIC DW 20 2000 367.0 367.0 45.0 SN74HCT244NSR SO NS 20 2000 367.0 367.0 45.0 SN74HCT244PWR TSSOP PW 20 2000 367.0 367.0 38.0 SN74HCT244PWR TSSOP PW 20 2000 364.0 364.0 27.0 SN74HCT244PWRG4 TSSOP PW 20 2000 367.0 367.0 38.
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PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 TYP 9.97 SEATING PLANE PIN 1 ID AREA A 0.1 C 20 1 13.0 12.6 NOTE 3 18X 1.27 2X 11.43 10 11 B 7.6 7.4 NOTE 4 20X 0.51 0.31 0.25 C A B 2.65 MAX 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0 -8 0.3 0.1 1.27 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2.
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EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7.
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EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 11 10 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.