Datasheet

 
   
  
SCLS005D − MARCH 1984 − REVISED AUGUST 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D Operating Voltage Range of 4.5 V to 5.5 V
D High-Current 3-State True Outputs Can
Drive Up To 15 LSTTL Loads
D Low Power Consumption, 80-µA Max I
CC
D Typical t
pd
= 22 ns
D ±6-mA Output Drive at 5 V
D Low Input Current of 1 µA Max
D Inputs Are TTL-Voltage Compatible
D Eight D-Type Flip-Flops in a Single Package
D Full Parallel Access for Loading
description/ordering information
These 8-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
The eight flip-flops of the ’HCT374 devices are
edge-triggered D-type flip-flops. On the positive
transition of the clock (CLK) input, the Q outputs
are set to the logic levels that were set up at the
data (D) inputs.
An output-enable (OE
) input places the eight
outputs in either a normal logic state (high or low
logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the
bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines
without interface or pullup components.
ORDERING INFORMATION
T
A
PACKAGE
†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP − N Tube of 20 SN74HCT374N SN74HCT374N
SOIC − DW
Tube of 25 SN74HCT374DW
HCT374
SOIC − DW
Reel of 2000 SN74HCT374DWR
HCT374
−40°C to 85°C
SOP − NS Reel of 2000 SN74HCT374NSR HCT374
−40°C to 85°C
SSOP − DB Reel of 2000 SN74HCT374DBR HT374
Tube of 70 SN74HCT374PW
TSSOP − PW
Reel of 2000 SN74HCT374PWR
HT374
TSSOP − PW
Reel of 250 SN74HCT374PWT
HT374
CDIP − J Tube of 20 SNJ54HCT374J SNJ54HCT374J
−55°C to 125°C
CFP − W Tube of 85 SNJ54HCT374W SNJ54HCT374W
−55 C to 125 C
LCCC − FK Tube of 55 SNJ54HCT374FK SNJ54HCT374FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
3212019
910111213
4
5
6
7
8
18
17
16
15
14
8D
7D
7Q
6Q
6D
2D
2Q
3Q
3D
4D
1D 1Q OE
5Q
5D
V 8Q
4Q
GND
CLK
SN54HCT374 . . . FK PACKAGE
(TOP VIEW)
CC
SN54HCT374 ...J OR W PACKAGE
SN74HCT374 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
V
CC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
Copyright  2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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