SDLS180 − AUGUST 1979 − REVISED MARCH 1988 Copyright 1988, Texas Instruments Incorporated !"# $ %& ' # "$ (&)* %"# +"#', +&%#$ % ! # $('% %"# $ (' #-' #' !$ '.
SDLS180 − AUGUST 1979 − REVISED MARCH 1988 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SDLS180 − AUGUST 1979 − REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3
SDLS180 − AUGUST 1979 − REVISED MARCH 1988 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS540DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74LS540DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74LS540NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS540DBR SN74LS540DWR SSOP DB 20 2000 367.0 367.0 38.0 SOIC DW 20 2000 367.0 367.0 45.0 SN74LS540NSR SO NS 20 2000 367.0 367.0 45.0 SN74LS541DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74LS541NSR SO NS 20 2000 367.0 367.0 45.
MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.