Datasheet

 
    
  
SCLS398G − APRIL 1998 − REVISED APRIL 2005
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D 2-V to 5.5-V V
CC
Operation
D Max t
pd
of 7 ns at 5 V
D Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25°C
D Typical V
OHV
(Output V
OH
Undershoot)
>2.3 V at V
CC
= 3.3 V, T
A
= 25°C
D Support Mixed-Mode Voltage Operation on
All Ports
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
The ’LV367A devices are hex buffers and line
drivers designed for 2-V to 5.5-V V
CC
operation.
These devices are designed specifically to
improve both the performance and density of
3-state memory address drivers, clock drivers,
and bus-oriented receivers and transmitters.
The ’LV367A devices are organized as dual 4-line
and 2-line buffers/drivers with active-low
output-enable (1OE
and 2OE) inputs. When OE is
low, the device passes noninverted data from the
A inputs to the Y outputs. When OE
is high, the
outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE
should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
T
A
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC − D
Tube of 40 SN74LV367AD
LV367A
SOIC − D
Reel of 2500 SN74LV367ADR
LV367A
SOP − NS Reel of 2000 SN74LV367ANSR 74LV367A
−40°C to 85°C
SSOP − DB Reel of 2000 SN74LV367ADBR LV36A
−40 C to 85 C
TSSOP − PW
Reel of 2000 SN74LV367APWR
LV367A
TSSOP − PW
Reel of 250 SN74LV367APWT
LV367A
TVSOP − DGV Reel of 2000 SN74LV367ADGVR LV367A
CDIP − J Tube of 25 SNJ54LV367AJ SNJ54LV367AJ
−55°C to 125°C
CFP − W Tube of 150 SNJ54LV367AW SNJ54LV367AW
−55 C to 125 C
LCCC − FK Tube of 55 SNJ54LV367AFK SNJ54LV367AFK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
3212019
910111213
4
5
6
7
8
18
17
16
15
14
2A2
2Y2
NC
2A1
2Y1
1Y1
1A2
NC
1Y2
1A3
1A1
1OE
NC
1Y4
1A4
V
2OE
1Y3
GND
NC
SN54LV367A . . . FK PACKAGE
(TOP VIEW)
CC
NC − No internal connection
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1OE
1A1
1Y1
1A2
1Y2
1A3
1Y3
GND
V
CC
2OE
2A2
2Y2
2A1
2Y1
1A4
1Y4
SN54LV367A ...J OR W PACKAGE
SN74LV367A ...D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
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Copyright 2005, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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