Datasheet

YZV PACKAGE
(TOP VIEW)
A
GND Y
V
CC
A1
A2
B1 B2
DNU – Do not use
YZP PACKAGE
(TOP VIEW)
A
GND
DNU
V
CC
Y
C2C1
B1 B2
A1 A2
N.C. – No internal connection
See mechanical drawings for dimensions.
DBV PACKAGE
(TOP VIEW)
2
5
3
4
Y
1
A
GND
N.C.
V
CC
DCK PACKAGE
(TOP VIEW)
3
4
2
Y
1
GND
A
N.C.
5
V
CC
DRL PACKAGE
(TOP VIEW)
2
A
1
N.C.
3
4
GND
Y
5
V
CC
DRY PACKAGE
(TOP VIEW)
A
N.C.
N.C.
6
5
4
2
3
GND
Y
V
CC
1
N.C.
GND
DSF PACKAGE
(TOP VIEW)
A
V
CC
Y
N.C.
6
5
4
2
3
1
SN74LVC1G06
www.ti.com SCES295V –JUNE 2000–REVISED NOVEMBER 2012
SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
Check for Samples: SN74LVC1G06
1
FEATURES
2
• Available in the Texas Instruments
• I
off
Supports Live Insertion, Partial Power
NanoFree™ Package Down Mode, and Back Drive Protection
• Supports 5-V V
CC
Operation • Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• Input and Open-Drain Output Accept
Voltages up to 5.5 V • ESD Protection Exceeds JESD 22
• Max t
pd
of 4 ns at 3.3 V – 2000-V Human-Body Model (A114-A)
• Low Power Consumption, 10-μA Max I
CC
– 200-V Machine Model (A115-A)
• ±24-mA Output Drive at 3.3 V – 1000-V Charged-Device Model (C101)
Table 1. YZP PACKAGE TERMINAL
ASSIGNMENTS
1 2
A DNU V
CC
B A No ball
C GND Y
Table 2. YZV PACKAGE TERMINAL
ASSIGNMENTS
1 2
A A V
CC
B GND Y
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2000–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.