Datasheet

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YZV PACKAGE

(TOP VIEW)

GND Y

B1 B2

DNU – Do not use

YZP PACKAGE

(TOP VIEW)

GND

DNU

C2C1

B1 B2

A1 A2

N.C. – No internal connection

See mechanical drawings for dimensions.

DBV PACKAGE

(TOP VIEW)

GND

N.C.

DCK PACKAGE

(TOP VIEW)

GND

N.C.

DRL PACKAGE

(TOP VIEW)

N.C.

GND

DRY PACKAGE

(TOP VIEW)

N.C.

GND

N.C.

GND

DSF PACKAGE

(TOP VIEW)

N.C.

SN74LVC1G07

www.ti.com

SCES296AA –FEBRUARY 2000–REVISED JULY 2013

SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

Check for Samples: SN74LVC1G07

FEATURES

DESCRIPTION

This single buffer/driver is designed for 1.65-V to 5.5-

• Available in the Texas Instruments

V V

operation.

NanoFree™ Package

NanoFree™ package technology is a major

• Supports 5-V V

Operation

breakthrough in IC packaging concepts, using the die

• Input and Open-Drain Output Accept

as the package.

Voltages up to 5.5 V

The output of the SN74LVC1G07 device is open

• Max t

of 4.2 ns at 3.3 V

drain and can be connected to other open-drain

• Low Power Consumption, 10-μA Max I

outputs to implement active-low wired-OR or active-

• ±24-mA Output Drive at 3.3 V

high wired-AND functions. The maximum sink current

is 32 mA.

• I

off

Supports Partial-Power-Down Mode

Operation

This device is fully specified for partial-power-down

applications using I

off

.The I

off

circuitry disables the

• Latch-Up Performance Exceeds 100 mA Per

outputs, preventing damaging current backflow

JESD 78, Class II

through the device when it is powered down.

• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

YZP PACKAGE TERMINAL ASSIGNMENTS

1 2

A DNU V

B A No ball

C GND Y

YZV PACKAGE TERMINAL ASSIGNMENTS

1 2

A A V

B GND Y

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (24 pages)

PAGE 1
SN74LVC1G07 www.ti.com SCES296AA – FEBRUARY 2000 – REVISED JULY 2013 SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT Check for Samples: SN74LVC1G07 FEATURES DESCRIPTION • This single buffer/driver is designed for 1.65-V to 5.5V VCC operation. 1 2 • • • • • • • • Available in the Texas Instruments NanoFree™ Package Supports 5-V VCC Operation Input and Open-Drain Output Accept Voltages up to 5.5 V Max tpd of 4.2 ns at 3.3 V Low Power Consumption, 10-μA Max ICC ±24-mA Output Drive at 3.
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SN74LVC1G07 SCES296AA – FEBRUARY 2000 – REVISED JULY 2013 www.ti.com FUNCTION TABLE INPUT A OUTPUT Y L L H H LOGIC DIAGRAM (POSITIVE LOGIC) (DBV, DCK, DRL, DSF, DRY, and YZP Package) A 2 4 Y LOGIC DIAGRAM (POSITIVE LOGIC) (YZV Package) A 1 3 Y ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC MIN MAX Supply voltage range –0.5 6.5 UNIT V (2) VI Input voltage range –0.5 6.
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SN74LVC1G07 www.ti.com SCES296AA – FEBRUARY 2000 – REVISED JULY 2013 RECOMMENDED OPERATING CONDITIONS (1) VCC Operating Supply voltage Data retention only 5.5 UNIT V 0.65 × VCC VCC = 2.3 V to 2.7 V High-level input voltage MAX 1.5 VCC = 1.65 V to 1.95 V VIH MIN 1.65 1.7 VCC = 3 V to 3.6 V V 2 VCC = 4.5 V to 5.5 V 0.7 × VCC VCC = 1.65 V to 1.95 V 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 VIL Low-level input voltage VI Input voltage 0 5.
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SN74LVC1G07 SCES296AA – FEBRUARY 2000 – REVISED JULY 2013 www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC1G07 PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y –40°C to 85°C UNIT VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V MIN MAX MIN MAX MIN MAX MIN MAX 2.4 8.3 1 5.5 1.5 4.2 1 3.
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SN74LVC1G07 www.ti.com SCES296AA – FEBRUARY 2000 – REVISED JULY 2013 PARAMETER MEASUREMENT INFORMATION (OPEN DRAIN) VLOAD S1 RL From Output Under Test Open TEST GND RL CL (see Note A) S1 tPZL (see Notes E and F) VLOAD tPLZ (see Notes E and G) VLOAD tPHZ/tPZH VLOAD LOAD CIRCUIT INPUT VCC VI 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VM tr/tf ≤ 2 ns ≤ 2 ns ≤ 2.5 ns ≤ 2.5 ns VCC VCC 3V VCC VLOAD VCC/2 VCC/2 1.
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SN74LVC1G07 SCES296AA – FEBRUARY 2000 – REVISED JULY 2013 www.ti.com REVISION HISTORY Changes from Revision W (June 2008) to Revision X • Added DSF Package to datasheet ....................................................................................................................................... 1 Changes from Revision Y (June 2011) to Revision Z • 6 Page Removed Ordering Information table. .......................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 27-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) SN74LVC1G07DBVR SOT-23 DBV 5 3000 178.0 9.0 SN74LVC1G07DBVR SOT-23 DBV 5 3000 180.0 SN74LVC1G07DBVR SOT-23 DBV 5 3000 178.0 SN74LVC1G07DBVT SOT-23 DBV 5 250 SN74LVC1G07DBVT SOT-23 DBV 5 W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 9.2 3.
PAGE 11
PACKAGE MATERIALS INFORMATION www.ti.com 27-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC1G07DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74LVC1G07DBVR SOT-23 DBV 5 3000 205.0 200.0 33.0 SN74LVC1G07DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 SN74LVC1G07DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 SN74LVC1G07DBVT SOT-23 DBV 5 250 205.0 200.0 33.0 SN74LVC1G07DBVT SOT-23 DBV 5 250 180.
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D: Max = 1.418 mm, Min =1.358 mm E: Max = 0.918 mm, Min =0.
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D: Max = 0.918 mm, Min =0.858 mm E: Max = 0.918 mm, Min =0.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.