Datasheet

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DESCRIPTION/ORDERING INFORMATION
SN74LVC1G10
SINGLE 3-INPUT POSITIVE-NAND GATE
SCES486D SEPTEMBER 2003 REVISED JANUARY 2007
Available in the Texas Instruments Operation
NanoFree™ Package
Latch-Up Performance Exceeds 100 mA per
Supports 5-V V
CC
Operation JESD 78, Class II
Inputs Accept Voltages to 5.5 V ESD Protection Exceeds JESD 22
Max t
pd
of 3.8 ns at 3.3 V 2000-V Human-Body Model (A114-A)
Low Power Consumption, 10- µ A Max I
CC
200-V Machine Model (A115-A)
± 24-mA Output Drive at 3.3 V 1000-V Charged Device Model (C101)
I
off
Supports Partial-Power-Down Mode
The SN74LVC1G10 performs the Boolean function Y = A B C or Y = A + B + C in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ WCSP (DSBGA)
Reel of 3000 SN74LVC1G10YZPR _ _ _C2_
0.23-mm Large Bump YZP (Pb-free)
–40°C to 85°C
SOT (SOT-23) DBV Reel of 3000 SN74LVC1G10DBVR C10_
SOT (SC-70) DCK Reel of 3000 SN74LVC1G10DCKR C2_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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