Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Demultiplexer, decoder Decoder/demultiplexer Single supply US 8

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FEATURES

abc

A V

GND

DCT PACKAGE

(TOP VIEW)

YEP OR YZP PACKAGE

(BOTTOM VIEW)

DCU PACKAGE

(TOP VIEW)

4 5

A V

Y0B

GND

See mechanical drawings for dimensions.

Y3 Y1

DESCRIPTION/ORDERING INFORMATION

SN74LVC1G139

2-TO-4 LINE DECODER

SCES602B – AUGUST 2004 – REVISED DECEMBER 2005

• Available in the Texas Instruments • Latch-Up Performance Exceeds 100 mA Per

NanoStar™ and NanoFree™ Packages JESD 78, Class II

• Supports 5-V V

Operation • ESD Protection Exceeds JESD 22

• Inputs Accept Voltages to 5.5 V – 2000-V Human-Body Model (A114-A)

• Max t

of 4.9 ns at 3.3 V – 200-V Machine Model (A115-A)

• Low Power Consumption, 10- µ A Max I

– 1000-V Charged-Device Model (C101)

• ± 24-mA Output Drive at 3.3 V

• I

off

Supports Partial-Power-Down Mode

Operation

This 2-to-4 line decoder is designed for 1.65-V to 5.5-V V

operation.

The SN74LVC1G139 2-line to 4-line decoder is designed to be used in high-performance memory-decoding or

data-routing applications requiring very short propagation delay times. In high-performance memory systems, this

decoder can be used to minimize the effects of system decoding. When used with high-speed memories utilizing

a fast enable circuit, the delay times of these decoders and the enable time of the memory usually are less than

the typical access time of the memory. This means that the effective system delay introduced by the decoder is

negligible.

ORDERING INFORMATION

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

(2)

NanoStar™ – WCSP (DSBGA)

SN74LVC1G139YEPR

0.23-mm Large Bump – YEP

Reel of 3000 _ _ _C9_

NanoFree™ – WCSP (DSBGA)

SN74LVC1G139YZPR

0.23-mm Large Bump – YZP (Pb-free)

–40 ° C to 85 ° C

Reel of 3000 SN74LVC1G139DCTR

SSOP – DCT C39_ _ _

Reel of 250 SN74LVC1G139DCTT

Reel of 3000 SN74LVC1G139DCUR

VSSOP – DCU C39_

Reel of 250 SN74LVC1G139DCUT

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (17 pages)

PAGE 1
SN74LVC1G139 2-TO-4 LINE DECODER www.ti.com SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 FEATURES • • • • • • • • Available in the Texas Instruments NanoStar™ and NanoFree™ Packages Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 4.9 ns at 3.3 V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.
PAGE 2
SN74LVC1G139 2-TO-4 LINE DECODER www.ti.com SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
PAGE 3
SN74LVC1G139 2-TO-4 LINE DECODER www.ti.com SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range –0.5 6.5 V –0.5 6.5 V –0.5 VCC + 0.
PAGE 4
SN74LVC1G139 2-TO-4 LINE DECODER www.ti.com SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 Recommended Operating Conditions (1) VCC Supply voltage Operating Data retention only VCC = 1.65 V to 1.95 V VIH High-level input voltage VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V MIN MAX 1.65 5.5 1.5 Low-level input voltage V 0.65 × VCC 1.7 V 2 0.7 × VCC 0.35 × VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 V 0.3 × VCC VCC = 4.
PAGE 5
SN74LVC1G139 2-TO-4 LINE DECODER www.ti.com SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA VOH 1.65 V to 5.5 V 1.65 V 1.2 IOH = –8 mA 2.3 V 1.9 4.5 V IOL = 100 µA 1.65 V to 5.5 V 0.1 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.3 IOL = 32 mA 0.4 VI = 5.5 V or GND VI or VO = 5.5 V ICC VI = 5.5 V or GND, IO = 0 ∆ICC One input at VCC – 0.
PAGE 6
SN74LVC1G139 2-TO-4 LINE DECODER www.ti.com SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.
PAGE 7
SN74LVC1G139 2-TO-4 LINE DECODER www.ti.com SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.
PAGE 8
PACKAGE OPTION ADDENDUM www.ti.
PAGE 9
PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PAGE 10
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVC1G139DCUR US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC1G139YZPR DSBGA YZP 8 3000 178.0 9.2 1.02 2.02 0.63 4.0 8.
PAGE 11
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC1G139DCUR US8 DCU 8 3000 202.0 201.0 28.0 SN74LVC1G139YZPR DSBGA YZP 8 3000 220.0 220.0 35.
PAGE 12
MECHANICAL DATA MPDS049B – MAY 1999 – REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 8 0,13 M 5 0,15 NOM ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ 2,90 2,70 4,25 3,75 Gage Plane PIN 1 INDEX AREA 1 0,25 4 0° – 8° 3,15 2,75 0,60 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 NOTES: A. B. C. D. 4188781/C 09/02 All linear dimensions are in millimeters. This drawing is subject to change without notice.
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D: Max = 1.918 mm, Min =1.858 mm E: Max = 0.918 mm, Min =0.
PAGE 17
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.