Datasheet

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Seemechanicaldrawingsfordimensions.
DCTPACKAGE
(TOP VIEW)
DCUPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
1
V
CC
8
G
2
7
Y1 Y0
3 6
A0
A1
4
5
GND Y2
3 6
A1A0
8
1
V
CC
G
5
GND
4
Y2
2
7
Y0Y1
GND
5
4
Y2
3 6
A1A0
2
7
Y0Y1
8
V
CC
1
G
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G29
2-OF-3 DECODER/DEMULTIPLEXER
SCES569B – JUNE 2004 – REVISED JANUARY 2007
• Available in the Texas Instruments • I
off
Supports Partial-Power-Down Mode
NanoFree™ Package Operation
• Supports 5-V V
CC
Operation • Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• Inputs Accept Voltages to 5.5 V
• ESD Protection Exceeds JESD 22
• Max t
pd
of 5.1 ns at 3.3 V
– 2000-V Human-Body Model (A114-A)
• Low Power Consumption, 10- µ A Max I
CC
– 200-V Machine Model (A115-A)
• ± 24-mA Output Drive at 3.3 V
– 1000-V Charged-Device Model (C101)
• Typical V
OLP
(Output Ground Bounce) <0.8 V
at V
CC
= 3.3 V, T
A
= 25 ° C
• Typical V
OHV
(Output V
OH
Undershoot) >2 V at
V
CC
= 3.3 V, T
A
= 25 ° C
This decoder is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G29 is a 2-of-3 decoder/demultiplexer. When the enable ( G) input signal is low, only one of the
outputs is in the low state, depending on the input levels of A0 and A1. When G is high, Y0, Y1, and Y2 are
high, regardless of the input states.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP Reel of 3000 SN74LVC1G29YZPR _ _ _D9_
(Pb-free)
Reel of 3000 SN74LVC1G29DCTR
–40 ° C to 85 ° C
SSOP – DCT C29_ _ _
Reel of 250 SN74LVC1G29DCTT
Reel of 3000 SN74LVC1G29DCUR
VSSOP – DCU C29_
Reel of 250 SN74LVC1G29DCUT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.