Datasheet

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FEATURES
3
2
4
61
A C
Y
GND
B
DBV PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
61
A C
Y
GND
B
A
B
C
Y
GND
See mechanical drawings for dimensions.
1
4
2
3
6
V
CC
V
CC
5
V
CC
5
5
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G3208
SINGLE 3-INPUT POSITIVE OR-AND GATE
SCES605A SEPTEMBER 2004 REVISED JUNE 2005
Can Be Used in Three Combinations:
Available in the Texas Instruments OR-AND Gate
NanoStar™ and NanoFree™ Packages
OR Gate
Supports 5-V V
CC
Operation
AND Gate
Inputs Accept Voltages to 5.5 V
I
off
Supports Partial-Power-Down Mode
Max t
pd
of 5 ns at 3.3 V Operation
Low Power Consumption, 10- µ A Max I
CC
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
± 24-mA Output Drive at 3.3 V
ESD Protection Exceeds JESD 22
Input Hysteresis Allows Slow Input Transition
and Better Switching Noise Immunity at the 2000-V Human-Body Model (A114-A)
Input
200-V Machine Model (A115-A)
(V
hys
= 250 mV Typ @ 3.3 V)
1000-V Charged-Device Model (C101)
This device is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G3208 is a single 3-input positive OR-AND gate. It performs the Boolean function Y = (A + B) C
in positive logic.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoStar™ WCSP (DSBGA)
SN74LVC1G3208YEPR
0.23-mm Large Bump YEP
Reel of 3000 _ _ _ DD _
NanoFree™ WCSP (DSBGA)
0.23-mm Large Bump YZP SN74LVC1G3208YZPR
(Pb-free)
–40 ° C to 85 ° C
Reel of 3000 SN74LVC1G3208DBVR
SOT (SOT-23) DBV CDD_
Reel of 250 SN74LVC1G3208DBVT
Reel of 3000 SN74LVC1G3208DCKR
SOT (SC-70) DCK DD_
Reel of 250 SN74LVC1G3208DCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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