Datasheet

See mechanical drawings for dimensions.
N.C. – No internal connection
DBV PACKAGE
(TOP VIEW)
3
4
GND
2
A
Y
V
CC
5
1
N.C.
DCK PACKAGE
(TOP VIEW)
3
4
GND
2
A
Y
5
1
N.C.
V
CC
DRL PACKAGE
(TOP VIEW)
2
A
V
CC
5
1
N.C.
3
4
GNDGND
Y
DRY PACKAGE
(TOP VIEW)
A N.C.
N.C.
6
5
4
2
3
GND
Y
V
CC
1
N.C.
GND
DSF PACKAGE
(TOP VIEW)
A
V
CC
Y
N.C.
6
5
4
2
3
1
DNU – Do not use
YZP PACKAGE
(TOP VIEW)
A
Y
C1
C2
B1
A1 A2
GND
DNU V
CC
B1 B2
A1 A2
YZV PACKAGE
(TOP VIEW)
Y
GND
A
V
CC
B1 B2
A1 A2
YFP PACKAGE
(TOP VIEW)
GND
A
Y
V
CC
SN74LVC1G34
www.ti.com SCES519I – DECEMBER 2003– REVISED JUNE 2011
SINGLE BUFFER GATE
Check for Samples: SN74LVC1G34
1
FEATURES
2
• Available in the Texas Instruments NanoFree™
• I
off
Supports Live Insertion, Partial Power
Package Down Mode, and Back Drive Protection
• Supports 5-V V
CC
Operation • Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• Inputs Accept Voltages to 5.5 V
• ESD Protection Exceeds JESD 22
• Max t
pd
of 3.5 ns at 3.3 V
– 2000-V Human-Body Model (A114-A)
• Low Power Consumption, 1-μA Max I
CC
– 200-V Machine Model (A115-A)
• ±24-mA Output Drive at 3.3 V
– 1000-V Charged-Device Model (C101)
Table 1. YZP PACKAGE TERMINAL
ASSIGNMENTS
1 2
A DNU V
CC
B A No ball
C GND Y
Table 2. YZV/YFP PACKAGE TERMINAL
ASSIGNMENTS
B GND Y
A A V
CC
1 2
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.