Datasheet

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Seemechanicaldrawingsfordimensions.
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
2
GND
V
CC
5
3
4
D
Q
6
1
LE
OE
3
4
D
2
GND
Q
5
1
LE
V
CC
6
OE
YZP PACKAGE
(BOTTOMVIEW)
2
GND
V
CC
1
5
LE
D
4
3
Q
6
OE
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G373
SINGLE D-TYPE LATCH
WITH 3-STATE OUPUT
SCES528C DECEMBER 2003 REVISED MAY 2007
Available in the Texas Instruments I
off
Supports Partial-Power-Down Mode
NanoFree™ Package Operation
Supports 5-V V
CC
Operation Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Inputs Accept Voltages to 5.5 V
ESD Protection Exceeds JESD 22
Max t
pd
of 4 ns at 3.3 V
2000-V Human-Body Model (A114-A)
Low Power Consumption, 10- µ A Max I
CC
200-V Machine Model (A115-A)
± 24-mA Output Drive at 3.3 V
1000-V Charged-Device Model (C101)
This single D-type latch is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G373 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers,
and working registers. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When
LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.
While the latch-enable (LE) input is high, the Q output follows the data (D) input. When LE is taken low, the Q
output is latched at the logic level set up at the D input.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERING PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ WCSP (DSBGA)
Reel of 3000 SN74LVC1G373YZPR _ _ _D3_
0.23-mm Large Bump YZP (Pb-free)
Reel of 3000 SN74LVC1G373DBVR
SOT (SOT-23) DBV CA3_
–40 ° C to 85 ° C
Reel of 250 SN74LVC1G373DBVT
Reel of 3000 SN74LVC1G373DCKR
SOT (SC-70) DCK D3_
Reel of 250 SN74LVC1G373DCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(3) DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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