Datasheet

www.ti.com
FEATURES
Seemechanicaldrawingsfordimensions.
DBVPACKAGE
(TOP VIEW)
5
1
V
CC
D
2
CLK
3
4
GND Q
DCKPACKAGE
(TOP VIEW)
2
CLK
3
4
GND
V
CC
5
D
Q
1
YZP PACKAGE
(BOTTOMVIEW)
2
CLK
V
CC
1
5
D
GND
4
3
Q
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G80
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
SCES221Q APRIL 1999 REVISED JANUARY 2007
Available in the Texas Instruments Latch-Up Performance Exceeds 100 mA Per
NanoFree™ Package JESD 78, Class II
Supports 5-V V
CC
Operation ESD Protection Exceeds JESD 22
Inputs Accept Voltages to 5.5 V 2000-V Human-Body Model (A114-A)
Max t
pd
of 4.2 ns at 3.3 V 200-V Machine Model (A115-A)
Low Power Consumption, 10- µ A Max I
CC
1000-V Charged-Device Model (C101)
± 24-mA Output Drive at 3.3 V
I
off
Supports Partial-Power-Down Mode
Operation
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V V
CC
operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without
affecting the level at the output.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ WCSP (DSBGA)
Reel of 3000 SN74LVC1G80YZPR _ _ _CX_
0.23-mm Large Bump YZP (Pb-free)
Reel of 3000 SN74LVC1G80DBVR
SOT (SOT-23) DBV C80_
–40°C to 85°C
Reel of 250 SN74LVC1G80DBVT
Reel of 3000 SN74LVC1G80DCKR
SOT (SC-70) DCK CX_
Reel of 250 SN74LVC1G80DCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Summary of content (18 pages)