Datasheet

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3
2
4
51
A V
CC
Y
B
GND
DCK PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G86-EP
SINGLE 2-INPUT EXCLUSIVE-OR GATE
SCES679 JULY 2007
Controlled Baseline Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
One Assembly/Test Site, One Fabrication
Site ESD Protection Exceeds JESD 22
Extended Temperature Performance of -55 ° C 2000-V Human-Body Model (A114-A)
to 125 ° C
200-V Machine Model (A115-A)
Enhanced Diminishing Manufacturing Sources
1000-V Charged-Device Model (C101)
(DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree
(1)
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 6.7 ns at 3.3 V
Low Power Consumption, 15- μ A Max I
CC
± 24-mA Output Drive at 3.3 V
I
off
Supports Partial-Power-Down Mode
Operation
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over specified
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this
component beyond specified performance and environmental
limits.
This single 2-input exclusive-OR gate is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G86 performs the Boolean function Y = A B or Y = AB + A B in positive logic.
A common application is as a true/complement element. If the input is low, the other input is reproduced in true
form at the output. If the input is high, the signal on the other input is reproduced inverted at the output.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
–55 ° C to 125 ° C SOT (SC-70) DCK Reel of 3000 SN74LVC1G86MDCKREP CJ_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DCK: The actual top-side marking has one additional character that designates the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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