Datasheet

1
FEATURES
Seemechanicaldrawingsfordimensions.
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
2
GND
V
CC
5
3
4
In0
Y
6
1
In1
In2
3
4
In0
2
GND
Y
5
1
In1
V
CC
6
In2
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G97-Q1
www.ti.com ........................................................................................................................................................ SCES561D – MARCH 2004 – REVISED APRIL 2008
CONFIGURABLE MULTIPLE-FUNCTION GATE
• Qualified for Automotive Applications • Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• Supports 5-V V
CC
Operation
• ESD Protection Exceeds JESD 22
• Inputs Accept Voltages to 5.5 V
– 2000-V Human-Body Model (A114-A)
• Max t
pd
of 7.3 ns at 3.3 V
– 200-V Machine Model (A115-A)
• Low Power Consumption, 10- µ A Max I
CC
– 1000-V Charged-Device Model (C101)
• ± 24-mA Output Drive at 3.3 V
• Choose From Nine Specific Logic Functions
• I
off
Supports Partial-Power-Down Mode
Operation
This configurable multiple-function gate is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G97 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All
inputs can be connected to V
CC
or GND.
This device functions as an independent gate but, because of Schmitt action, it may have different input
threshold levels for positive-going (V
T+
) and negative-going (V
T –
) signals.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
SOT (SOT-23) – DBV Reel of 3000 SN74LVC1G97QDBVRQ1 C97_
– 40 ° C to 125 ° C
SOT (SC-70) – DCK Reel of 3000 SN74LVC1G97QDCKRQ1 CS_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004 – 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.