Datasheet

1
FEATURES
SUPPORTS DEFENSE, AEROSPACE,
3
2
4
61
V
CCA
V
CCB
B
GND
A
DCK PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
DIR
5
DESCRIPTION/ORDERING INFORMATION
SN74LVC1T45-EP
www.ti.com
........................................................................................................................................................................................... SCES768 NOVEMBER 2008
SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
Fully Configurable Dual-Rail Design Allows Latch-Up Performance Exceeds 100 mA Per
Each Port to Operate Over the Full 1.65-V to JESD 78, Class II
5.5-V Power-Supply Range
ESD Protection Exceeds JESD 22
V
CC
Isolation Feature If Either V
CC
Input Is at
2000-V Human-Body Model (A114-A)
GND, Both Ports Are in the High-Impedance
200-V Machine Model (A115-A)
State
1000-V Charged-Device Model (C101)
DIR Input Circuit Referenced to V
CCA
Low Power Consumption, 4- µ A Max I
CC
± 24-mA Output Drive at 3.3 V AND MEDICAL APPLICATIONS
Controlled Baseline
I
off
Supports Partial-Power-Down Mode
Operation
One Assembly/Test Site
One Fabrication Site
Max Data Rates
Available in Military ( 55 ° C/125 ° C)
420 Mbps (3.3-V to 5-V Translation)
Temperature Range
(1)
210 Mbps (Translate to 3.3 V)
Extended Product Life Cycle
140 Mbps (Translate to 2.5 V)
Extended Product-Change Notification
75 Mbps (Translate to 1.8 V)
Product Traceability
(1) Additional temperature ranges are available contact factory
This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track V
CCA
. V
CCA
accepts any supply voltage from 1.65 V to 5.5 V. The B port is designed to track
V
CCB
. V
CCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional
translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
55 ° C to 125 ° C SOT (SC-70) DCK Reel of 3000 SN74LVC1T45MDCKREP NXG
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com .
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package .
(3) The actual top-side marking has one additional character that designates the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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