Datasheet

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DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
V
CC
OE
B1
B2
B3
B4
B5
B6
B7
B8
DB, DGV, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
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10 11
2
3
4
5
6
7
8
9
19
18
17
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12
OE
B1
B2
B3
B4
B5
B6
B7
A1
A2
A3
A4
A5
A6
A7
A8
DIR
B8
V
GND
CC
SN74LVC245A
www.ti.com SCAS218W –JANUARY 1993–REVISED MAY 2013
OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS
Check for Samples: SN74LVC245A
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FEATURES
• Operates From 1.65 V to 3.6 V
• Inputs Accept Voltages to 5.5 V
• Max t
pd
of 6.3 ns at 3.3 V
• Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25°C
• Typical V
OHV
(Output V
OH
Undershoot)
>2 V at V
CC
= 3.3 V, T
A
= 25°C
• I
off
Supports Partial-Power-Down Mode
Operation
• Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With 3.3-V V
CC
)
• Latch-Up Performance Exceeds 250 mA Per
JESD 17
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This octal bus transceiver is designed for 1.65-V to
3.6-V V
CC
operation.
The SN74LVC245A is designed for asynchronous
communication between data buses. The device
transmits data from the A bus to the B bus or from
the B bus to the A bus, depending on the logic level
at the direction-control (DIR) input. The output-enable
(OE) input can be used to disable the device so the
buses effectively are isolated.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in
a mixed 3.3-V/5-V system environment.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1993–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.