Datasheet

1
FEATURES
Seemechanicaldrawingsfordimensions.
DCKPACKAGE
(TOP VIEW)
3
4
2A
2
GND
2Y
5
1
1A
V
CC
6
1Y
DESCRIPTION/ORDERING INFORMATION
SN74LVC2G07-EP
www.ti.com
....................................................................................................................................................................................................... SCES719 MAY 2008
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
Controlled Baseline Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
One Assembly Site
Max t
pd
of 5.7 ns at 3.3 V
One Test Site
Low Power Consumption, 10 µ A Max I
CC
One Fabrication Site
± 24-mA Output Drive at 3.3 V
Extended Temperature Performance of 55 ° C
to 125 ° C Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25 ° C
Enhanced Diminishing Manufacturing Sources
(DMS) Support Typical V
OHV
(Output V
OH
Undershoot)
>2 V at V
CC
= 3.3 V, T
A
= 25 ° C
Enhanced Product-Change Notification
I
off
Supports Partial-Power-Down Mode
Qualification Pedigree
(1)
Operation
Supports 5-V V
CC
Operation
Latch-Up Performance Exceeds 100 mA Per
(1) Component qualification in accordance with JEDEC and
JESD 78, Class II
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
ESD Protection Exceeds JESD 22
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
2000-V Human-Body Model (A114-A)
electromigration, bond intermetallic life, and mold compound
200-V Machine Model (A115-A)
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
1000-V Charged-Device Model (C101)
performance and environmental limits.
This dual buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation. The output of the SN74LVC2G07 is open
drain and can be connected to other open-drain outputs to implement active low wired OR or active high wired
AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
55 ° C to 125 ° C SOT (SC-70) DCK Reel of 250 SN74LVC2G07MDCKTEP CHC
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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