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GND

VCC

GND

VCC

DRY PACKAGE

(TOP VIEW)

DSF PACKAGE

(TOP VIEW)

GND

VCC

YZP PACKAGE

(BOTTOM VIEW)

GND

VCC

DCK PACKAGE

(TOP VIEW)

VCC

DBV PACKAGE

(TOP VIEW)

GND

SN74LVC2G07

www.ti.com

SCES308K –AUGUST 2001–REVISED NOVEMBER 2013

Dual Buffer/Driver With Open Drain Outputs

Check for Samples: SN74LVC2G07

FEATURES

DESCRIPTION

This dual buffer/driver is designed for 1.65-V to 5.5-V

• Available in the Texas Instruments NanoFree™

operation. The output of the SN74LVC2G07 is

Package

open drain and can be connected to other open-drain

• Supports 5-V V

Operation

outputs to implement active-low wired-OR or active-

• Inputs and Open-Drain Outputs Accept

high wired-AND functions. The maximum sink current

is 32 mA.

Voltages up to 5.5 V

• Max t

of 3.7 ns at 3.3 V

NanoFree™ package technology is a major

breakthrough in IC packaging concepts, using the die

• Low Power Consumption, 10-μA Max I

as the package.

• ±24-mA Output Drive at 3.3 V

This device is fully specified for partial-power-down

• Typical V

OLP

(Output Ground Bounce)

applications using I

off

. The I

off

circuitry disables the

<0.8 V at V

= 3.3 V, T

= 25°C

outputs, preventing damaging current backflow

• Typical V

OHV

(Output V

Undershoot)

through the device when it is powered down.

>2 V at V

= 3.3 V, T

= 25°C

• I

off

Supports Live Insertion, Partial Power

Down Mode, and Back Drive Protection

• Support Translation-Up/Down

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (21 pages)

PAGE 1
SN74LVC2G07 www.ti.com SCES308K – AUGUST 2001 – REVISED NOVEMBER 2013 Dual Buffer/Driver With Open Drain Outputs Check for Samples: SN74LVC2G07 FEATURES DESCRIPTION • This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or activehigh wired-AND functions. The maximum sink current is 32 mA.
PAGE 2
SN74LVC2G07 SCES308K – AUGUST 2001 – REVISED NOVEMBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
PAGE 3
SN74LVC2G07 www.ti.com SCES308K – AUGUST 2001 – REVISED NOVEMBER 2013 Recommended Operating Conditions (1) VCC Operating Supply voltage Data retention only 5.5 UNIT V 0.65 × VCC VCC = 2.3 V to 2.7 V High-level input voltage MAX 1.5 VCC = 1.65 V to 1.95 V VIH MIN 1.65 1.7 VCC = 3 V to 3.6 V V 2 VCC = 4.5 V to 5.5 V 0.7 × VCC VCC = 1.65 V to 1.95 V 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 VIL Low-level input voltage VI Input voltage 0 5.
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SN74LVC2G07 SCES308K – AUGUST 2001 – REVISED NOVEMBER 2013 www.ti.com Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC2G07 –40°C to 125°C PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 1.5 8.6 1 4.9 1 4.2 1 3.
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SN74LVC2G07 www.ti.com SCES308K – AUGUST 2001 – REVISED NOVEMBER 2013 Parameter Measurement Information (Open Drain) VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tPZL (see Notes E and F) tPLZ (see Notes E and G) tPHZ/tPZH VLOAD VLOAD VLOAD LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.
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SN74LVC2G07 SCES308K – AUGUST 2001 – REVISED NOVEMBER 2013 www.ti.com REVISION HISTORY Changes from Revision I (July 2012) to Revision J • Page Updated pin out packages. ................................................................................................................................................... 1 Changes from Revision J (August 2012) to Revision K Page • Updated document to new TI data sheet format. ...............................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 30-Oct-2013 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.
PAGE 9
PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) SN74LVC2G07DBVR SOT-23 DBV 6 3000 178.0 9.2 SN74LVC2G07DBVR SOT-23 DBV 6 3000 178.0 SN74LVC2G07DBVR SOT-23 DBV 6 3000 180.
PAGE 10
PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC2G07DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 SN74LVC2G07DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 SN74LVC2G07DBVR SOT-23 DBV 6 3000 205.0 200.0 33.0 SN74LVC2G07DCKR SC70 DCK 6 3000 205.0 200.0 33.0 SN74LVC2G07DCKR SC70 DCK 6 3000 180.0 180.0 18.0 SN74LVC2G07DCKR SC70 DCK 6 3000 180.0 180.
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D: Max = 1.418 mm, Min =1.357 mm E: Max = 0.918 mm, Min =0.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.