Datasheet

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Seemechanicaldrawingsfordimensions.
DCTPACKAGE
(TOP VIEW)
DCUPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
1
V
CC
8
COM
2
7
INH Y1
3 6
GND
Y2
4
5
GND A
3 6
Y2GND
8
1
V
CC
COM
5
GND
4
A
2
7
Y1INH
GND
5
4
A
3 6
Y2GND
2
7
Y1INH
8
V
CC
1
COM
DESCRIPTION/ORDERING INFORMATION
SN74LVC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
• Available in the Texas Instruments • Low On-State Resistance, Typically 96.5 Ω
NanoFree™ Package (V
CC
= 4.5 V)
• 1.65-V to 5.5-V V
CC
Operation • Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• High On-Off Output Voltage Ratio
• ESD Protection Exceeds JESD 22
• High Degree of Linearity
– 2000-V Human-Body Model (A114-A)
• High Speed, Typically 0.5 ns (V
CC
= 3 V,
C
L
= 50 pF) – 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
This dual analog multiplexer/demultiplexer is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74LVC2G53YZPR _ _ _C4_
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT Reel of 3000 SN74LVC2G53DCTR C53_ _ _
–40 ° C to 85 ° C
Reel of 3000 SN74LVC2G53DCUR
VSSOP – DCU C53_
Reel of 250 SN74LVC2G53DCUT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.