Datasheet

www.ti.com
FEATURES
DB, DGV, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
V
CC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
DESCRIPTION/ORDERING INFORMATION
SN74LVCZ240A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES273H – JUNE 1999 – REVISED APRIL 2005
• Operates From 2.7 V to 3.6 V
• Inputs Accept Voltages to 5.5 V
• Max t
pd
of 6.5 ns at 3.3 V
• Typical V
OLP
(Output Ground Bounce)
< 0.8 V at V
CC
= 3.3 V, T
A
= 25°C
• Typical V
OHV
(Output V
OH
Undershoot)
> 2 V at V
CC
= 3.3 V, T
A
= 25°C
• I
off
and Power-Up 3-State Support Hot
Insertion
• Supports Mixed-Mode Signal Operation on
All Ports (5-V Input/Output Voltage With
3.3-V V
CC
)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
This octal buffer/driver is designed for 2.7-V to 3.6-V V
CC
operation.
The SN74LVCZ240A is designed specifically to improve the performance and density of 3-state memory address
drivers, clock drivers, and bus-oriented receivers and transmitters.
This device is organized as two 4-bit buffers/drivers with separate output-enable ( OE) inputs. When OE is low,
the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in
a mixed 3.3-V/5-V system environment.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
PDIP – N Tube of 20 SN74LVCZ240AN SN74LVCZ240AN
Tube of 25 SN74LVCZ240ADW
SOIC – DW LVCZ240A
Reel of 2000 SN74LVCZ240ADWR
SOP – NS Reel of 2000 SN74LVCZ240ANSR LVCZ240A
–40°C to 85°C SSOP – DB Reel of 2000 SN74LVCZ240ADBR CV240A
Tube of 70 SN74LVCZ240APW
TSSOP – PW Reel of 2000 SN74LVCZ240APWR CV240A
Reel of 250 SN74LVCZ240APWT
TVSOP – DGV Reel of 2000 SN74LVCZ240ADGVR CV240A
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.