Datasheet
SN75468
,
SN75469
SLRS023E –DECEMBER 1976–REVISED JANUARY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CE
Collector-emitter voltage 100 V
V
I
Input voltage
(2)
30 V
Peak collector current 500 mA
I
OK
Output clamp current 500 mA
Total emitter-terminal current –2.5 A
T
J
Operating virtual junction temperature 150 °C
T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted.
7.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±2000
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22-C101,
±500
all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
I
0 5 V
V
CC
0 100 V
T
J
Junction Temperature –40 125 °C
7.4 Thermal Information
SN7546x
THERMAL METRIC
(1)
D UNIT
16 PINS
R
θJA
Junction-to-ambient thermal resistance 73
R
θJC(top)
Junction-to-case (top) thermal resistance 40.3
R
θJB
Junction-to-board thermal resistance 38.9
°C/W
ψ
JT
Junction-to-top characterization parameter 10.9
ψ
JB
Junction-to-board characterization parameter 38.7
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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