Datasheet

44 PIN
DDV PACKAGE
(TOP VIEW)
VDD
OC_ADJ
RESET
INPUT_A
INPUT_B
C_START
DVDD
GND
GND
GND
GND
AVDD
INPUT_C
INPUT_D
FAULT
OTW
CLIP
M1
M2
M3
GVDD_CD
BST_C
GVDD_ABGVDD_AB
GND
GND
OUT_D
OUT_D
PVDD_CD
PVDD_CD
PVDD_CD
OUT_C
GND
GND
OUT_B
PVDD_AB
PVDD_AB
PVDD_AB
OUT_A
OUT_A
GND
GND
BST_B
BST_A
BST_D
TAS5614LA
SLAS846 –MAY 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
GENERAL INFORMATION
Terminal Assignment
The TAS5614LA is available in a thermally enhanced package:
• 44-Pin HTSSOP package (DDV)
The package contains a PowerPAD™ that is located on the top side of the device for convenient thermal
coupling to the heat sink.
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Product Folder Link(s): TAS5614LA