Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Audio amplifier 1-channel (mono) or 2-channel (stereo) Class D HSSOP 44

TAS5630

PurePath

TAS5631

TAS5518

Digital PWM

Processor

DIGITAL

AUDIO

INPUT

♫♪

TAS5631

www.ti.com

SLES221C –JULY 2009–REVISED APRIL 2010

300-W STEREO / 600-W MONO PurePath™ HD DIGITAL-INPUT POWER STAGE

Check for Samples: TAS5631

FEATURES APPLICATIONS

• Mini Combo System

• PurePath™ HD Enabled Integrated Feedback

Provides:

• AV Receivers

• DVD Receivers

– Signal Bandwidth up to 80 kHz for

High-Frequency Content From HD Sources

• Active Speakers

– Ultralow 0.03% THD at 1 W Into 4 Ω

DESCRIPTION

– Flat THD at All Frequencies for Natural

Sound

The TAS5631 is a high-performance PWM input

class-D amplifier with integrated closed-loop

– 80-dB PSRR (BTL, No Input Signal)

feedback technology (known as PurePath HD

– >100-dB (A-weighted) SNR

technology) with the ability to drive up to 300 W

(1)

– Click- and Pop-Free Start-Up

stereo into 4-Ω to 8-Ω speakers from a single 50-V

supply.

• Multiple Configurations Possible on the Same

PCB With Stuffing Options:

PurePath HD technology enables traditional

– Mono Parallel Bridge-Tied Load (PBTL) AB-amplifier performance (<0.03% THD) levels while

providing the power efficiency of traditional class-D

– Stereo Bridge-Tied Load (BTL)

amplifiers.

– 2.1 Single-Ended Stereo Pair and

Unlike traditional class-D amplifiers, the distortion

Bridge-Tied Load Subwoofer

curve only increases once the output levels move into

– Quad Single-Ended Outputs

clipping. PurePath HD™

• Total Output Power at 10% THD+N

PurePath HD technology enables lower idle losses,

– 600 W in Mono PBTL Configuration

making the device even more efficient.

– 300 W per Channel in Stereo BTL

Configuration

Note 1. Achievable output power levels are

– 145 W per Channel in Quad Single-Ended

dependent on the thermal configuration of the target

Configuration

application. A high-performance thermal interface

material between the package exposed heat slug

• High-Efficiency Power Stage (>88%) With

and the heat sink should be used to achieve high

60-mΩ Output MOSFETs

output-power levels.

• Two Thermally Enhanced Package Options:

– PHD (64-Pin QFP)

– DKD (44-Pin PSOP3)

• Self-Protection Design (Including

Undervoltage, Overtemperature, Clipping, and

Short-Circuit Protection) With Error Reporting

• EMI Compliant When Used With

Recommended System Design

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PurePath HD is a trademark of Texas Instruments.

3All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Not Recommended For New Designs

Summary of content (35 pages)

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Not Recommended For New Designs TAS5631 www.ti.com SLES221C – JULY 2009 – REVISED APRIL 2010 300-W STEREO / 600-W MONO PurePath™ HD DIGITAL-INPUT POWER STAGE Check for Samples: TAS5631 FEATURES APPLICATIONS • • • • • 1 23 • • • • • • PurePath™ HD Enabled Integrated Feedback Provides: – Signal Bandwidth up to 80 kHz for High-Frequency Content From HD Sources – Ultralow 0.
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Not Recommended For New Designs TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DEVICE INFORMATION Terminal Assignment Both package types contains a heat slug that is located on the top side of the device for convenient thermal coupling to the heat sink.
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Not Recommended For New Designs www.ti.
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Not Recommended For New Designs TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted (1) TAS5631 UNIT VDD to AGND –0.3 to 13.2 V GVDD to AGND –0.3 to 13.2 V –0.3 to 69 V PVDD_X to GND_X (2) OUT_X to GND_X (2) –0.3 to 69 V –0.3 to 82.2 V BST_X to GVDD_X (2) –0.3 to 69 V VREG to AGND –0.3 to 4.2 V GND_X to GND –0.3 to 0.3 V GND_X to AGND –0.3 to 0.3 V GND to AGND –0.3 to 0.
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Not Recommended For New Designs www.ti.com TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 TERMINAL FUNCTIONS (continued) TERMINAL Function (1) DESCRIPTION NAME PHD NO. DKD NO. BST_C 40 33 P BST_D 27 24 P HS bootstrap supply (BST); external 0.033-mF capacitor to OUT_D required CLIP 18 — O Clipping warning; open drain; active-low C_STARTUP 3 5 O Start-up ramp requires a charging capacitor of 4.7 nF to AGND.
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Not Recommended For New Designs TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 www.ti.
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Not Recommended For New Designs www.ti.
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Not Recommended For New Designs TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 www.ti.com AUDIO CHARACTERISTICS (BTL) Audio performance is recorded as a chipset consisting of a TAS5518 PWM processor (modulation index limited to 97.7%) and a TAS5631 power stage. PCB and system configurations are in accordance with recommended guidelines.
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Not Recommended For New Designs www.ti.com TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 AUDIO SPECIFICATION (PBTL) Audio performance is recorded as a chipset consisting of a TAS5518 PWM processor (modulation index limited to 97.7%) and a TAS5631 power stage. PCB and system configurations are in accordance with recommended guidelines.
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Not Recommended For New Designs TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 www.ti.com ELECTRICAL CHARACTERISTICS (continued) PVDD_X = 50V, GVDD_X = 12 V, VDD = 12V, TC (case temperature) = 75°C, fS = 384 kHz, unless otherwise specified. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT I/O PROTECTION Vuvp,G Undervoltage protection limit, GVDD_X Vuvp,hyst 10 (1) V 0.
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Not Recommended For New Designs www.ti.com TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 TYPICAL CHARACTERISTICS, BTL CONFIGURATION TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER OUTPUT POWER vs SUPPLY VOLTAGE 320 THD+N - Total Harmonic Distortion + Noise - % 10 5 TC = 75°C 300 280 260 PO - Output Power - W 2 1 0.5 0.2 0.1 4W 6W 0.05 0.
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Not Recommended For New Designs TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 www.ti.
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Not Recommended For New Designs www.ti.com TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 TYPICAL CHARACTERISTICS, SE CONFIGURATION TOTAL HARMONIC dISTORTION + NOISE vs OUTPUT POWER OUTPUT POWER vs SUPPLY VOLTAGE 160 5 TC = 75°C 150 140 130 4W 2 1 PO - Output Power - W THD+N - Total Harmonic Distortion + Noise - % 10 3W 0.5 2W 0.2 0.1 0.05 2W 120 110 100 3W 90 80 70 4W 60 50 40 30 20 0.02 0.01 0.
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Not Recommended For New Designs TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS, PBTL CONFIGURATION TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 5 650 T TC = 75°C 1 550 3W 2 2 W (TC = 50oC) 500 4W 0.5 6W 0.2 TC = 75°C THD+N at 10% 600 o 2 W (TC = 50 C) PO - Output Power - W THD+N - Total Harmonic Distortion + Noise - % 10 OUTPUT POWER vs SUPPLY VOLTAGE 8W 0.1 0.05 3W 450 400 4W 350 6W 300 8W 250 200 150 0.02 100 0.01 0.
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Not Recommended For New Designs www.ti.com TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 APPLICATION INFORMATION PCB MATERIAL RECOMMENDATION FR-4 2-oz. (70 mm) glass epoxy material is recommended for use with the TAS5631. The use of this material can provide for higher power output, improved thermal performance, and better EMI margin (due to lower PCB trace inductance). PVDD CAPACITOR RECOMMENDATION The large capacitors used in conjunction with each full bridge are referred to as the PVDD capacitors.
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R_RIGHT_N IN_RIGHT_P IN_LEFT_N IN_LEFT_P /RESET 100R R13 100R R12 100R R11 100R R10 100R Submit Documentation Feedback Product Folder Link(s): TAS5631 GND READY /CLIP /OTW2 /OTW1 /SD C18 100pF GND R19 47k GND GND GND GND 100nF C22 VREG GND VREG 4.7uF C21 4.7nF 22.0k C20 R20 4.
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/CLIP READY 100R 100R 100R GND 100pF GND VREG 47k GND GND GND GND 100nF 4.7uF 4.7nF 22.0k VREG VREG GND GND 1 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 /OTW1 /SD NC NC TEST INPUT_D INPUT_C VREG AGND GND VI_CM INPUT_B INPUT_A C_STARTUP /RESET OC_ADJ 4.7uF GND GND 100nF GND GND GND GND 100nF GND 100nF GND GND 100nF TAS5631PHD VREG 33nF 3.3R 3.3R 33nF 2.
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READY /CLIP /OTW2 /OTW1 /SD IN_D IN_C IN_B IN_A /RESET Submit Documentation Feedback Product Folder Link(s): TAS5631 150 kOhm 169 kOhm 191 kOhm 191 kOhm 196 kOhm 50 V 49 V 48 V 47 V <47 V R_COMP PVDD 100R 100R 100R 100R GND 100pF PVDD PVDD C A 47k 10k 470uF 10k 10k 470uF 470uF GND 10k R_COMP R_COMP 100nF 4.7uF 10nF 470uF GND GND GND GND GND 22.
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100R 100R 100R GND 100pF 47k VREG GND GND GND GND 100nF VREG 4.7uF 10nF 22.0k GND 1 191 kOhm 191 kOhm 196 kOhm 47 V <47 V 169 kOhm 49 V 48 V R_COMP 150 kOhm /OTW1 /SD NC NC TEST INPUT_D INPUT_C VREG AGND GND VI_CM INPUT_B INPUT_A C_STARTUP /RESET OC_ADJ PVDD 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 4.7uF 50 V VREG VREG GND 64 VDD GND GND 100nF 100nF 61 VREG 100nF GND GND GND 59 100nF GND GND GND 100nF TAS5631PHD GND 33nF 3.3R 3.3R 3.
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Submit Documentation Feedback Product Folder Link(s): TAS5631 READY /OTW /SD IN_RIGHT_N IN_RIGHT_P IN_LEFT_N IN_LEFT_P /RESET VDD (+12V) 100R 100R 100R 100R 100R GND 100pF VREG 47k GND GND GND GND GND 100nF 4.7uF 4.7nF 24k 4.
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Not Recommended For New Designs www.ti.com TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 THEORY OF OPERATION POWER SUPPLIES To facilitate system design, the TAS5631 needs only a 12-V supply in addition to the (typical) 50-V power-stage supply. An internal voltage regulator provides suitable voltage levels for the digital and low-voltage analog circuitry. Additionally, all circuitry requiring a floating voltage supply, e.g.
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Not Recommended For New Designs TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 www.ti.com ERROR REPORTING The SD, OTW, OTW1, and OTW2 pins are active-low, open-drain outputs. Their function is for protection-mode signaling to a PWM controller or other system-control device. Any fault resulting in device shutdown is signaled by the SD pin going low.
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Not Recommended For New Designs www.ti.com TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 output LC filter. The typical duration is <15 ms/mF. While the PPSC detection is in progress, SD is kept low, and the device does not react to changes applied to the RESET pin. If no shorts are present, the PPSC detection passes, and SD is released. A device reset does not start a new PPSC detection. PPSC detection is enabled in BTL and PBTL output configurations; the detection is not performed in SE mode.
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Not Recommended For New Designs TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 www.ti.com PRINTED CIRCUIT BOARD RECOMMENDATION Use an unbroken ground plane to have good low-impedance and -inductance return path to the power supply for power and audio signals. PCB layout, audio performance and EMI are linked closely together. The circuit contains high, fast-switching currents; therefore, care must be taken to prevent damaging voltage spikes.
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Not Recommended For New Designs www.ti.com TAS5631 SLES221C – JULY 2009 – REVISED APRIL 2010 Note B1: It is important to have a direct, low-impedance return path for high current back to the power supply. Keep impedance low from top to bottom side of PCB through a lot of ground vias. Note B2: Bootstrap low-impedance X7R ceramic capacitors placed on bottom side provide a short low-inductance current loop. Note B3: Return currents from bulk capacitors and output filter capacitors Figure 20.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TAS5631DKDR HSSOP DKD 44 500 330.0 24.4 TAS5631PHDR HTQFP PHD 64 1000 330.0 24.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 14.7 16.4 4.0 20.0 24.0 Q1 17.0 17.0 1.5 20.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TAS5631DKDR HSSOP DKD TAS5631PHDR HTQFP PHD 44 500 367.0 367.0 45.0 64 1000 367.0 367.0 45.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.