Datasheet

DGN−8
D−8
NC − No internal connection
1
2
3
4
8
7
6
5
NC
IN
IN+
V
CC−
NC
V
CC+
OUT
NC
THS3001
D OR DGN PACKAGE
(TOP VIEW)
f − Frequency − Hz
OUTPUT AMPLITUDE
vs FREQUENCY
5
3
1
−1
1M 100M
6
4
2
0
10M 1G100k
7
8
Output Amplitude − dB
G = 2
R
L
= 150
V
I
= 200 mV RMS
HARMONIC DISTORTION
vs FREQUENCY
−70
−80
−90
−100
−75
−85
−95
Harmonic Distortion − dBc
Gain = 2
V
CC
= ±15 V
V
O
= 2 V
PP
R
L
= 150
R
F
= 750
100k 1M 10M
f − Frequency − Hz
V
CC
= ±15 V
R
F
= 680
V
CC
= ±5 V
R
F
= 750
3rd Harmonic
2nd Harmonic
THS3001
www.ti.com
................................................................................................................................................. SLOS217H JULY 1998REVISED SEPTEMBER 2009
420-MHz HIGH-SPEED CURRENT-FEEDBACK AMPLIFIER
Check for Samples: THS3001
1
FEATURES
APPLICATIONS
Communication
2
High Speed:
Imaging
420-MHz Bandwidth (G = 1, -3 dB)
High-Quality Video
6500-V/μs Slew Rate
40-ns Settling Time (0.1%)
High Output Drive: I
O
= 100 mA
Excellent Video Performance
115-MHz Bandwidth (0.1 dB, G = 2)
0.01% Differential Gain
0.02° Differential Phase
Low 3-mV (max) Input Offset Voltage
Very Low Distortion:
THD = –96 dBc at f = 1 MHz
RELATED DEVICES
THD = –80 dBc at f = 10 MHz
THS4011 /2 290-MHz VFB High-Speed Amplifier
Wide Range of Power Supplies:
THS6012 500-mA CFB HIgh-Speed Amplifier
V
CC
= ±4.5 V to ±16 V
THS6022 250-mA CFB High-Speed Amplifier
Evaluation Module Available
DESCRIPTION
The THS3001 is a high-speed current-feedback operational amplifier, ideal for communication, imaging, and
high-quality video applications. This device offers a very fast 6500-V/μs slew rate, a 420-MHz bandwidth, and
40-ns settling time for large-signal applications requiring excellent transient response. In addition, the THS3001
operates with a very low distortion of –96 dBc, making it well suited for applications such as wireless
communication basestations or ultrafast ADC or DAC buffers.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 1998–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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