Datasheet

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ADDITIONAL REFERENCE MATERIAL
THS4302
SLOS403H – OCTOBER 2002 – REVISED AUGUST 2006
Table 1. BILL OF MATERIALS - THS4302RGT EVM
REFERENCE PCB MANUFACTURER'S
ITEM DESCRIPTION SMD SIZE
DESIGNATOR QUANTITY PART NUMBER
1 Bead, ferrite, 3 A, 80 Ω 1206 FB1, FB2 2 (Steward) HI1206N800R-00
2 Cap. 22 μ F, tantalum, 25 V, 10% D C2, C3 2 (AVX) TAJD226K025R
3 Cap. 1 μ F, ceramic, 25 V, Y5V 0805 C1 1 (AVX) 08053G105ZAT2A
4 Open 0402 C6, C7 2
5 Cap. 47 pF, ceramic, 50 V, NPO 0402 C8, C9 2 (AVX) 04025A470JAT2A
6 Cap. 0.1 μ F, ceramic, 16 V, X7R 0603 C4, C5 2 (AVX) 0603YC104KAT2A
7 Resistor, 30.1 Ω , 1/16 W, 1% 0402 R4, R5 2 (KOA) RK73H1E30R1F
8 Open 0603 R3 1
(Phycomp)
9 Resistor, 49.9 Ω , 1/16 W, 1% 0603 R1, R2 2
9C06031A49R9FKRFT
10 Jack, banana receptance, 0.25 ” dia. hole J3, J4, J5 3 (HH Smith) 101
11 Test point, red J6 1 (Keystone) 5000
12 Test point, black TP1 1 (Keystone) 5001
13 Connector, edge, SMA PCB jack J1, J2 2 (Johnson) 142-0701-801
14 IC THS4302 U1 1 (TI) THS4302RGT
15 Standoff, 4-40 hex, 0.625 ” length 4 (Keystone) 1808
16 Screw, phillips, 4-40, 0.250 ” 4 SHR-0440-016-SN
17 Board, printed-circuit 1 (TI) EDGE # 6443548 Rev. C
• PowerPAD Made Easy, application brief (SLMA004)
• PowerPAD Thermally Enhanced Package, technical brief (SLMA002)
20 Submit Documentation Feedback Copyright © 2002 – 2006, Texas Instruments Incorporated
Product Folder Link(s): THS4302