Datasheet

DGK-8DGN-8 D-8
1
FEATURES APPLICATIONS
1
2
3
4
8
7
6
5
V
IN−
V
IN+
V
OCM
V
S+
V
OUT+
PD
V
S−
V
OUT
RELATED DEVICES
DESCRIPTION
-
+
-
+
V
OCM
12 Bit/80 MSps
IN
IN
5 V
V
ref
5 V
V
S
0.1 µF 10 µF
499
8.2 pF
1 µF
53.6
ADC
487
50
523
499
8.2 pF
24.9
24.9
THS4504
THS4505
www.ti.com
......................................................................................................................................................... SLOS363D AUGUST 2002 REVISED MAY 2008
WIDEBAND, LOW-DISTORTION, FULLY DIFFERENTIAL AMPLIFIERS
High Linearity Analog-to-Digital Converter
23
Fully Differential Architecture
Preamplifier
Bandwidth: 260 MHz
Wireless Communication Receiver Chains
Slew Rate: 1800 V/ µ s
Single-Ended to Differential Conversion
IMD
3
: 73 dBc at 30 MHz
Differential Line Driver
OIP
3
: 29 dBm at 30 MHz
Active Filtering of Differential Signals
Output Common-Mode Control
Wide Power-Supply Voltage Range: 5 V, ± 5 V,
12 V, 15 V
Input Common-Mode Range Shifted to Include
the Negative Power-Supply Rail
Power-Down Capability (THS4504)
Evaluation Module Available
DEVICE
(1)
DESCRIPTION
The THS4504 and THS4505 are high-performance,
fully differential amplifiers from Texas Instruments.
THS4504/5 260 MHz, 1800 V/ µ s, V
ICR
Includes V
S
The THS4504, featuring power-down capability, and
THS4500/1 370 MHz, 2800 V/ µ s, V
ICR
Includes V
S
the THS4505, without power-down capability, set new
THS4502/3 370 MHz, 2800 V/ µ s, Centered V
ICR
performance standards for fully differential amplifiers
THS4120/1 3.3 V, 100 MHz, 43 V/ µ s, 3.7 nV/ Hz
with unsurpassed linearity, supporting 12-bit
THS4130/1 15 V, 150 MHz, 51 V/ µ s, 1.3 nV/ Hz
operation through 40 MHz. Package options include
the SOIC-8 and the MSOP-8 with PowerPAD™ for a
THS4140/1 15 V, 160 MHz, 450 V/ µ s, 6.5 nV/ Hz
smaller footprint, enhanced ac performance, and
THS4150/1 15 V, 150 MHz, 650 V/ µ s, 7.6 nV/ Hz
improved thermal dissipation capability.
(1) Even numbered devices feature power-down capability
APPLICATION CIRCUIT DIAGRAM
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 PowerPAD is a trademark of Texas Instruments, Incorporated.
3 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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