Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Op-amp Multi-purpose SOIC 16 N

–

TLC080 , TLC081, TLC082

TLC083, TLC084, TLC085, TLC08xA

www.ti.com

SLOS254F –JUNE 1999– REVISED DECEMBER 2011

FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY

OPERATIONAL AMPLIFIERS

Check for Samples: TLC080 , TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA

FEATURES

DESCRIPTION

The first members of TI’s new BiMOS

• Wide Bandwidth: 10 MHz

general-purpose operational amplifier family are the

• High Output Drive:

TLC08x. The BiMOS family concept is simple:

– I

: 57 mA at V

– 1.5 V

provide an upgrade path for BiFET users who are

moving away from dual-supply to single-supply

– I

: 55 mA at 0.5 V

systems and demand higher ac and dc performance.

• High Slew Rate:

With performance rated from 4.5 V to 16 V across

– SR+: 16 V/µs

commercial (0°C to 70°C) and an extended industrial

temperature range (–40°C to 125°C), BiMOS suits a

– SR–: 19 V/µs

wide range of audio, automotive, industrial, and

• Wide Supply Range: 4.5 V to 16 V

instrumentation applications. Familiar features like

• Supply Current: 1.9 mA/Channel

offset nulling pins, and new features like MSOP

PowerPAD™ packages and shutdown modes, enable

• Ultralow Power Shutdown Mode:

higher levels of performance in a variety of

– I

: 125 µA/Channel

applications.

• Low Input Noise Voltage: 8.5 nV√Hz

Developed in TI’s patented LBC3 BiCMOS process,

• Input Offset Voltage: 60 µV

the new BiMOS amplifiers combine a very high input

• Ultra-Small Packages:

impedance, low-noise CMOS front end with a

high-drive bipolar output stage, thus providing the

– 8- or 10-Pin MSOP (TLC080/1/2/3)

optimum performance features of both. AC

performance improvements over the TL08x BiFET

predecessors include a bandwidth of 10 MHz (an

increase of 300%) and voltage noise of 8.5 nV/√Hz

(an improvement of 60%). DC improvements include

an ensured V

ICR

that includes ground, a factor of 4

reduction in input offset voltage down to 1.5 mV

(maximum) in the standard grade, and a power

supply rejection improvement of greater than 40 dB to

130 dB. Added to this list of impressive features is

the ability to drive ±50-mA loads comfortably from an

ultrasmall-footprint MSOP PowerPAD package, which

positions the TLC08x as the ideal high-performance

general-purpose operational amplifier family.

FAMILY PACKAGE TABLE

PACKAGE TYPES

NO. OF UNIVERSAL

DEVICE

CHANNELS EVM BOARD

MSOP PDIP SOIC TSSOP SHUTDOWN

TLC080 1 8 8 8 — Yes

TLC081 1 8 8 8 —

Refer to the EVM

TLC082 2 8 8 8 — —

Selection Guide

TLC083 2 10 14 14 — Yes

(Lit# SLOU060)

TLC084 4 14 14 20 —

TLC085 4 16 16 20 Yes

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments.

3All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (53 pages)

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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS Check for Samples: TLC080 , TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FEATURES DESCRIPTION • • The first members of TI’s new BiMOS general-purpose operational amplifier family are the TLC08x.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS at specified free-air temperature, VDD = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS TLC080/1/2/3, VIO Input offset voltage ∝VIO Temperature coefficient of input offset voltage TLC084/5 VDD = 5 V, VIC = 2.5 V, VO = 2.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) at specified free-air temperature, VDD = 5 V (unless otherwise noted) PARAMETER IDD TEST CONDITIONS Supply current (per channel) VO = 2.5 V, Supply current in shutdown IDD(SHDN) mode (per channel) (TLC080, TLC083, TLC085) No load TA (1) MIN MAX 1.8 2.5 25°C Full range 3.5 25°C SHDN ≤ 0.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) at specified free-air temperature, VDD = 12 V (unless otherwise noted) PARAMETER IDD TEST CONDITIONS Supply current (per channel) VO = 7.5 V, Supply current in shutdown IDD(SHDN) mode (TLC080, TLC083, TLC085) (per channel) No load TA (1) MIN MAX 1.9 2.9 25°C Full range 3.5 25°C SHDN ≤ 0.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS 1500 VDD = 5 V TA = 25° C 600 400 200 0 -200 -400 1100 900 700 500 300 100 -100 -300 -600 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -500 0 3 4 5 6 7 8 9 10 11 12 200 150 100 IIB 50 0 IIO -50 -100 -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 TA – Free-Air Temperature – °C Figure 1. Figure 2. Figure 3.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS POWER SUPPLY REJECTION RATIO vs FREQUENCY 2.4 TA = 25°C TA = 40 °C 2.0 1.8 TA = 125°C 1.6 TA = 70°C 1.4 AV = 1 SHDN = VDD Per Channel 1.2 1.0 4 5 6 7 8 140 120 VDD = 12 V 100 80 60 40 VDD = 5 V 20 0 9 10 11 1 2 13 14 15 0 10 100k 1M 10M 100 80 60 40 20 0 100 1k 10k 100k 1M f – Frequency – Hz Figure 11. Figure 12.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS DIFFERENTIAL VOLTAGE GAIN AND PHASE vs FREQUENCY 80 Gain A VD – Different Voltage Gain – dB 60 -45 50 Phase 40 -90 30 20 -135 10 0 -10 -20 1k VDD = ±2.5 V RL = 10 kΩ CL = 0 pF TA = 25°C 10k -180 100k 1M 10M -225 100M 20 -135 10 0 -20 1k VDD = ±6 V RL = 10 kΩ CL = 0 pF TA = 25°C Rnull = 0 Ω 3.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS SLEW RATE vs FREE-AIR TEMPERATURE 25 Slew Rate Slew Rate – 20 15 Slew Rate + 10 15 Slew Rate + 10 5 VDD = 12 V RL= 600 Ω and 10 kΩ CL = 50 pF AV = 1 5 Total Harmonic Distortion + Noise – % VDD = 5 V RL= 600 Ω and 10 kΩ CL = 50 pF AV = 1 SR – Slew Rate – V/ms VDD = 5 V VO(PP) = 2 V RL = 10 kΩ AV = 100 0.1 AV = 10 0.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS SHUTDOWN PULSE SHUTDOWN PULSE 5.5 4 Shutdown Pulse I DD – Supply Current – mA 5.0 4.5 4.0 2 VDD = 5 V CL= 8 pF TA = 25°C 3.5 3.0 2.5 0 IDD RL = 10 kΩ 2.0 1.5 -2 IDD RL = 600 Ω 1.0 6 5.5 SD Off Shutdown Pulse - V I DD – Supply Current – mA 6.0 6 -4 0.5 SD Off 5.0 4 Shutdown Pulse 4.5 4.0 2 VDD = 12 V CL= 8 pF TA = 25°C 3.5 3.0 2.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com Driving a Capacitive Load When the amplifier is configured in this manner, capacitive loading directly on the output will decrease the device’s phase margin leading to high frequency ringing or oscillations. Therefore, for capacitive loads of greater than 10 pF, it is recommended that a resistor be placed in series (RNULL) with the output of the amplifier, as shown in Figure 47.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com High Speed CMOS Input Amplifiers The TLC08x is a family of high-speed low-noise CMOS input operational amplifiers that has an input capacitance of the order of 20 pF. Any resistor used in the feedback path adds a pole in the transfer function equivalent to the input capacitance multiplied by the combination of source resistance and feedback resistance.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com General Configurations When receiving low-level signals, limiting the bandwidth of the incoming signals into theFigure 50 system is often required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier (see ). RG RF VO + VI R1 C1 f V O V I = ( 1+ R R F G )( 1 –3dB = 2pR1C1 1 1 + sR1C1 ) Figure 50.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com Shutdown Function Three members of the TLC08x family (TLC080/3/5) have a shutdown terminal (SHDN) for conserving battery life in portable applications. When the shutdown terminal is tied low, the supply current is reduced to 125 µA/channel, the amplifier is disabled, and the outputs are placed in a high-impedance mode.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com General PowerPAD Design Considerations The TLC08x is available in a thermally-enhanced PowerPAD family of packages. These packages are constructed using a downset leadframe upon which the die is mounted [see Figure 52(a) and Figure 52(b)]. This arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see Figure 52(c)].
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com The PowerPAD must be connected to the most negative supply voltage (GND pin potential) of the device. 1. Prepare the PCB with a top side etch pattern (see the landing patterns at the end of this data sheet). There should be etch for the leads as well as etch for the thermal pad. 2. Place five holes (dual) or nine holes (quad) in the area of the thermal pad.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com Maximum Power Dissipation – W 7 6 5 4 3 2 PWP Package Low-K Test PCB θJA = 29.7°C/W TJ = 150°C SOT-23 Package Low-K Test PCB θJA = 324°C/W2 DGN Package Low-K Test PCB θJA = 52.3°C/W SOIC Package Low-K Test PCB θJA = 176°C/W PDIP Package Low-K Test PCB θJA = 104°C/W 1 0 -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 TA – Free-Air Temperature – °C A.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com Macromodel Information Macromodel information provided was derived using Microsim Parts™, the model generation software used with Microsim PSpice™. The Boyle macromodel (see (1)) and subcircuit in Figure 54 are generated using the TLC08x typical electrical and operating characteristics at TA = 25°C.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com Figure 54.
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TLC080 , TLC081, TLC082 TLC083, TLC084, TLC085, TLC08xA SLOS254F – JUNE 1999 – REVISED DECEMBER 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (April 2006) to Revision F • Page Updated Figure 9 ................................................................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production.
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PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLC080AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC080CDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TLC080CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant PAD TLC082CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC082IDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TLC082IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC083CDGQR MSOPPower PAD DGQ 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC080CDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TLC080CDR SOIC D 8 2500 340.5 338.1 20.6 TLC080IDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TLC080IDR SOIC D 8 2500 340.5 338.1 20.6 TLC081AIDR SOIC D 8 2500 340.5 338.1 20.6 TLC081CDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TLC081CDR SOIC D 8 2500 340.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.