Datasheet

TLC226x, TLC226xA, TLC226xY
Advanced LinCMOS
 RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS177 – FEBRUARY 1997
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC2262 AVAILABLE OPTIONS
T
V
PACKAGED DEVICES
CHIP
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CERAMIC
FLATPACK
(U)
CHIP
FORM
(Y)
0°C to
70°C
2.5 mV TLC2262CD — — TLC2262CP TLC2262CPWLE —
TLC2262Y
–40°C to 950 µV TLC2262AID — — TLC2262AIP TLC2262AIPWLE —
TLC2262Y
40 C to
125°C
950 µV
2.5 mV
TLC2262AID
TLC2262ID — —
TLC2262AIP
TLC2262IP
TLC2262AIPWLE
— —
TLC2262Y
–55°C to
125°C
950 µV
2.5 mV
—
—
TLC2262AMFK
TLC2262MFK
TLC2262AMJG
TLC2262MJG
—
—
—
—
TLC2262AMU
TLC2262MU
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2262CDR). The PW package is available only left-end taped
and reeled. Chips are tested at 25°C.
TLC2264 AVAILABLE OPTIONS
T
V
PACKAGED DEVICES
CHIP
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
(PW)
CERAMIC
FLATPACK
(W)
CHIP
FORM
(Y)
0°C to
70°C
2.5 mV TLC2264CD — — TLC2264CN TLC2264CPWLE —
TLC2262Y
–40°C to 950 µV TLC2264AID — — TLC2264AIN TLC2264AIPWLE —
TLC2262Y
40 C to
125°C
950 µV
2.5 mV
TLC2264AID
TLC2264ID — —
TLC2264AIN
TLC2264IN
TLC2264AIPWLE
— —
TLC2262Y
–55°C to
125°C
950 µV
2.5 mV
—
—
TLC2264AMFK
TLC2264MFK
TLC2264AMJ
TLC2264MJ
—
—
—
—
TLC2264AMW
TLC2264MW
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2264CDR). The PW package is available only left-end taped
and reeled. Chips are tested at 25°C.