Datasheet

   
    
SLOS051E − OCTOBER 1987 − REVISED AUGUST 2008
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D Trimmed Offset Voltage:
TLC27M7 . . . 500 µV Max at 25°C,
V
DD
= 5 V
D Input Offset Voltage Drift ...Typically
0.1 µV/Month, Including the First 30 Days
D Wide Range of Supply Voltages Over
Specified Temperature Ranges:
0°C to 70°C...3 V to 16 V
−40°C to 85°C...4 V to 16 V
−55°C to 125°C...4 V to 16 V
D Single-Supply Operation
D Common-Mode Input Voltage Range
Extends Below the Negative Rail (C-Suffix,
I-Suffix Types)
D Low Noise ...Typically 32 nV/Hz at
f = 1 kHz
D Low Power ...Typically 2.1 mW at 25°C,
V
DD
= 5 V
D Output Voltage Range Includes Negative
Rail
D High Input impedance ...10
12
Typ
D ESD-Protection Circuitry
D Small-Outline Package Option Also
Available in Tape and Reel
D Designed-In Latch-Up Immunity
1
2
3
4
8
7
6
5
1OUT
1IN −
1IN +
GND
V
CC
2OUT
2IN −
2IN +
D, JG, P OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN −
NC
NC
1IN −
NC
1IN +
NC
FK PACKAGE
(TOP VIEW)
NC
1OUT
NC
NC
NC
NC
GND
NC
NC − No internal connection
DD
V
2IN +
800
Percentage of Units − %
V
IO
− Input Offset Voltage − µV
30
800
0
400 0 400
5
10
15
20
25
T
A
= 25°C
P Package
DISTRIBUTION OF TLC27M7
INPUT OFFSET VOLTAGE
340 Units Tested From 2 Wafer Lots
V
DD
= 5 V
AVAILABLE OPTIONS
V
IO
max
PACKAGE
T
A
V
IO
max
AT 25°C
SMALL OUTLINE
(D)
CHIP CARRIER
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
TSSOP
(PW)
500 µV TLC27M7CD TLC27M7CP
0°C to 70°C
2 mV TLC27M2BCD TLC27M2BCP
0°C to 70°C
5 mV TLC27M2ACD TLC27M2ACP
10 mV TLC27M2CD TLC27M2CP TLC27M2CPW
500 µV TLC27M7ID TLC27M7IP
−40°C to 85°C
2 mV TLC27M2BID TLC27M2BIP
−40°C to 85°C
5 mV TLC27M2AID TLC27M2AIP
10 mV TLC27M2ID TLC27M2IP TLC27M2IPW
−55°C to 125°C
500 µV TLC27M7MD TLC27M7MFK TLC27M7MJG TLC27M7MP
−55
°
C to 125
°
C
10 mV TLC27M2MD TLC27M2MFK TLC27M2MJG TLC27M2MP
The D and PW package are available taped and reeled. Add R suffix to the device type (e.g.,TLC27M7CDR). For the most current package and
ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.
Copyright 1987 − 2008, Texas Instruments Incorporated
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