Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsData collecting ICsData acquisition IC - DA converter (DAC) SOIC 20

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SLAS060F − JANUARY 1995 − REVISED APRIL 2009

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

features

D Four 8-Bit D/A Converters

D Microprocessor Compatible

D TTL/CMOS Compatible

D Single Supply Operation Possible

D CMOS Technology

applications

D Process Control

D Automatic Test Equipment

D Automatic Calibration of Large System

Parameters, e.g. Gain/Offset

description

The TLC7226C, TLC7226I, and TLC7226M

consist of four 8-bit voltage-output digital-to-

analog converters (DACs) with output buffer

amplifiers and interface logic on a single

monolithic chip.

Separate on-chip latches are provided for each of

the four DACs. Data is transferred into one of

these data latches through a common 8-bit

TTL/CMOS-compatible 5-V input port. Control

inputs A0 and A1 determine which DAC is loaded

when WR

goes low. The control logic is speed

compatible with most 8-bit microprocessors.

Each DAC includes an output buffer amplifier

capable of sourcing up to 5 mA of output current.

The TLC7226 performance is specified for input reference voltages from 2 V to V

− 4 V with dual supplies.

The voltage mode configuration of the DACs allows the TLC7226 to be operated from a single power supply

rail at a reference of 10 V.

The TLC7226 is fabricated in a LinBiCMOS process that has been specifically developed to allow high-speed

digital logic circuits and precision analog circuits to be integrated on the same chip. The TLC7226 has a common

8-bit data bus with individual DAC latches. This provides a versatile control architecture for simple interface to

microprocessors. All latch-enable signals are level triggered.

Combining four DACs, four operational amplifiers, and interface logic into either a 0.3-inch wide, 20-terminal

dual-in-line IC (DIP) or a small 20-terminal small-outline IC (SOIC) allows a dramatic reduction in board space

requirements and offers increased reliability in systems using multiple converters. The Leadless Ceramic Chip

Carrier (LCCC) package provides for operation at military temperature range. The pinout is aimed at optimizing

board layout with all of the analog inputs and outputs at one end of the package and all of the digital inputs at

the other.

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

LinBiCMOS is a trademark of Texas Instruments.

OUTB

OUTA

REF

AGND

DGND

DB7

DB6

DB5

DB4

OUTC

OUTD

DB0

DB1

DB2

DB3

DW OR N PACKAGE

(TOP VIEW)

1920132

1312119 10

DB0

REF