Datasheet

TLV2354, TLV2354Y
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS
SLCS012C – MAY 1992 – REVISED AUGUST 2000
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2354Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2354. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
OUT
IN+
IN–
V
DD
GND
(10)
(7)
(6)
(11)
(1)
–
+
(13)
IN+
IN–
OUT
(12)
(4)
(5)
–
+
(2)
+
–
(9)
(8)
(14)
OUT
IN+
IN–
OUT
IN+
IN–
(3)
BONDING PAD ASSIGNMENTS
65
90
(13)
(1)
(3)
(4)
(5)
(6)
(7)
(8)
(9)(10)
(11)
(12)
(14)
(2)