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SGLS306A − APRIL 2005 − REVISED APRIL 2006

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251−1443

D Controlled Baseline

− One Assembly/Test Site, One Fabrication

Site

D Extended Temperature Performance of

−55°C to 125°C

D Enhanced Diminishing Manufacturing

Sources (DMS) Support

D Enhanced Product-Change Notification

D Qualification Pedigree

†

D Rail-To-Rail Input/Output

D Wide Bandwidth ...3 MHz

D High Slew Rate . . . 2.4 V/µs

†

Component qualification in accordance with JEDEC and industry

standards to ensure reliable operation over an extended

temperature range. This includes, but is not limited to, Highly

Accelerated Stress Test (HAST) or biased 85/85, temperature

cycle, autoclave or unbiased HAST, electromigration, bond

intermetallic life, and mold compound life. Such qualification

testing should not be viewed as justifying use of this component

beyond specified performance and environmental limits.

D Supply Voltage Range . . . 2.7 V to 16 V

D Supply Current . . . 550 µA/Channel

D Input Noise Voltage . . . 39 nV/√Hz

D Input Bias Current...1 pA

D Specified Temperature Range

−55°C to 125°C

D Ultrasmall Packaging

− 5-Pin SOT-23 (TLV2371)

− 8-Pin MSOP (TLV2372)

description

The TLV237x single supply operational amplifiers provide rail-to-rail input and output capability. The TLV237x

takes the minimum operating supply voltage down to 2.7 V over the extended automotive temperature range

while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz bandwidth from only

550 µA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from

(±8 V supplies down to ±1.35 V) a variety of rechargeable cells.

The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making

an ideal alternative for the TLC227x in battery-powered applications. The rail-to-rail input stage further

increases its versatility. The TLV237x is the seventh member of a rapidly growing number of RRIO products

available from Texas Instruments and it is the first to allow operation up to 16-V rails with good ac performance.

The 2.7-V operation makes the TLV237x compatible with Li-Ion powered systems and the operating supply

voltage range of many micro-power microcontrollers available today including Texas Instruments’ MSP430.

SELECTION OF SIGNAL AMPLIFIER PRODUCTS

†

DEVICE

(V)

(µV)

Iq/Ch

(µA)

(pA)

GBW

(MHz)

(V/µs)

SHUTDOWN

RAIL-

TO-

RAIL

SINGLES/DUALS/QUADS

TLV237x 2.7−16 500 550 1 3 2.4 Yes I/O S/D/Q

TLC227x 4−16 300 1100 1 2.2 3.6 — O D/Q

TLV27x 2.7−16 500 550 1 3 2.4 — O S/D/Q

TLC27x 3−16 1100 675 1 1.7 3.6 — — S/D/Q

TLV246x 2.7−6 150 550 1300 6.4 1.6 Yes I/O S/D/Q

TLV247x 2.7−6 250 600 2 2.8 1.5 Yes I/O S/D/Q

TLV244x 2.7−10 300 725 1 1.8 1.4 — O D/Q

†

Typical values measured at 5 V, 25°C

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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Operational Amplifier

−

Summary of content (22 pages)

PAGE 1
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 D Controlled Baseline D D D D D D D D D D D D − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† Rail-To-Rail Input/Output Wide Bandwidth . . . 3 MHz High Slew Rate . . . 2.
PAGE 2
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 FAMILY PACKAGE TABLE PACKAGE TYPES NUMBER OF CHANNELS SOIC TLV2371 1 TLV2372 2 TLV2374 4 DEVICE SOT-23 TSSOP MSOP 8 5 — — 8 — — 8 14 — 14 — UNIVERSAL EVM BOARD See the EVM Selection Guide (SLOU060) TLV2371 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOMAX AT 25°C −55°C to 125°C 4.
PAGE 3
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 TLV237x PACKAGE PINOUTS(1) TLV2371 DBV PACKAGE (TOP VIEW) OUT GND IN+ 1 5 TLV2371 D PACKAGE (TOP VIEW) VDD 2 3 4 NC IN − IN + GND 1 8 2 7 3 6 4 5 TLV2372 D OR DGK PACKAGE (TOP VIEW) NC VDD OUT NC 1OUT 1IN − 1IN + GND 1 8 2 7 3 6 4 5 VDD 2OUT 2IN − 2IN+ IN − TLV2374 D OR PW PACKAGE (TOP VIEW) 1OUT 1IN − 1IN+ VDD 2IN+ 2IN − 2OUT 1 14 2
PAGE 4
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 5
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless otherwise noted) dc performance PARAMETER TEST CONDITIONS TA MIN 25°C VIO Input offset voltage αVIO Offset voltage drift VO = VDD/2, VIC = VDD/2, RS = 50 Ω VIC = 0 to VDD−1.
PAGE 6
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless otherwise noted) (continued) output characteristics PARAMETER TEST CONDITIONS VIC = VDD/2, IOH = −1 mA TA MIN TYP 25°C 2.55 2.58 VDD = 2.7 V Full range 2.48 25°C 4.9 VDD = 5 V Full range 4.85 25°C 14.92 Full range 14.9 25°C 1.88 Full range 1.
PAGE 7
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless otherwise noted) (continued) dynamic performance PARAMETER UGBW Unity gain bandwidth TEST CONDITIONS RL = 2 kΩ, CL = 10 pF TA 2.4 VDD = 5 V to 15 V 25°C 3 25°C φm ts Slew rate at unity gain VO(PP) = VDD/2, CL = 50 pF, RL = 10 kΩ TYP 25°C VDD = 2.
PAGE 8
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 TYPICAL CHARACTERISTICS Table of Graphs FIGURE VIO CMRR Input offset voltage vs Common-mode input voltage Common-mode rejection ratio vs Frequency 4 Input bias and offset current vs Free-air temperature 5 VOL VOH Low-level output voltage vs Low-level output current 6, 8, 10 High-level output voltage vs High-level output current 7, 9, 11 VO(PP) IDD P
PAGE 9
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 TYPICAL CHARACTERISTICS INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 1000 800 600 400 200 0 1000 VDD = 5 V TA = 25 °C 800 600 400 200 0 −200 −200 0.4 0.8 1.2 1.6 2 0 VICR − Common-Mode Input Voltage − V 100 VDD = 5 V, 15 V 80 VDD = 2.
PAGE 10
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 TYPICAL CHARACTERISTICS 12 TA =70°C 10 TA =25°C 8 TA =0°C 6 TA =−40°C 4 2 15 14 VDD = 15 V 12 TA = −40°C V O(PP) − Peak-to-Peak Output Voltage − V VDD = 15 V TA =125°C V OH − High-Level Output Voltage − V VOL − Low-Level Output Voltage − V 15 14 PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT LOW-L
PAGE 11
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 TYPICAL CHARACTERISTICS SLEW RATE vs FREE-AIR TEMPERATURE 3.5 3 100 SR− SR+ 1 AV = 1 RL = 10 kΩ CL = 50 pF TA = 25°C 0.5 8.5 10.5 12.5 1.5 VDD = 5 V AV = 1 RL = 10 kΩ CL = 50 pF VI = 3 V 1 0 −40 −25 −10 5 14.
PAGE 12
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 TYPICAL CHARACTERISTICS INVERTING LARGE-SIGNAL RESPONSE VI 3 VDD = 5 V AV = 1 RL = 2 kΩ CL = 10 pF VI = 3 VPP TA = 25°C 2 1 0 3 2 1 0 VO 0 2 4 6 8 10 12 14 12 9 VDD = 15 V AV = −1 RL = 2 kΩ CL = 10 pF VI = 9 Vpp TA = 25°C 6 3 0 6 3 0 16 0 2 4 6 8 10 12 14 16 t − Time − µs Figure 26 Figure 25 CROSSTALK vs FREQUENCY INVERTING SMALL-SIGNAL
PAGE 13
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 APPLICATION INFORMATION rail-to-rail input operation The TLV237x input stage consists of two differential transistor pairs, NMOS and PMOS, that operate together to achieve rail-to-rail input operation. The transition point between these two pairs can be seen in Figure 2 through Figure 4 for a 2.7-V, 5-V, and 15-V supply.
PAGE 14
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 APPLICATION INFORMATION general configurations When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier (see Figure 31).
PAGE 15
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 APPLICATION INFORMATION circuit layout considerations To achieve the levels of high performance of the TLV237x, follow proper printed-circuit board design techniques. The following is a general set of guidelines. D Ground planes—It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection.
PAGE 16
µ SGLS306A − APRIL 2005 − REVISED APRIL 2006 APPLICATION INFORMATION general power dissipation considerations For a given θJA, the maximum power dissipation is shown in Figure 33 and is calculated by the following formula: P D + Where: ǒ T Ǔ –T MAX A q JA PD = Maximum power dissipation of TLV237x IC (watts) TMAX = Absolute maximum junction temperature (150°C) TA = Free-ambient air temperature (°C) θJA
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) TLV2371MDBVREP SOT-23 DBV 5 3000 180.0 TLV2374MDREP SOIC D 14 2500 330.0 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 9.0 3.15 3.2 1.4 4.0 8.0 Q3 16.4 6.5 9.0 2.1 8.0 16.
PAGE 18
PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2371MDBVREP SOT-23 TLV2374MDREP SOIC DBV 5 3000 182.0 182.0 20.0 D 14 2500 333.2 345.9 28.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.