Datasheet

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TLV2371-Q1, TLV2372-Q1, TLV2374-Q1

FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT

OPERATIONAL AMPLIFIERS

SGLS244A − MAY 2004 − REVISED JUNE 2008

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D Qualified for Automotive Applications

D Rail-To-Rail Input/Output

D Wide Bandwidth ...3 MHz

D High Slew Rate ...2.4 V/μs

D Supply Voltage Range ...2.7 V to 16 V

D Supply Current . . . 550 μA/Channel

D Input Noise Voltage . . . 39 nV/√Hz

D Input Bias Current...1 pA

D Specified Temperature Range

−40°C to 125°C . . . Automotive Grade

D Ultrasmall Packaging

− 5 Pin SOT-23 (TLV2371)

− 8 Pin MSOP (TLV2372)

description

The TLV237x single supply operational amplifiers provide rail-to-rail input and output capability. The TLV237x

takes the minimum operating supply voltage down to 2.7 V over the extended automotive temperature range

while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz bandwidth from only

550 μA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8

V supplies down to ±1.35 V) a variety of rechargeable cells.

The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making

an ideal alternative for the TLC227x in battery-powered applications. The rail-to-rail input stage further

increases its versatility. The TLV237x is the seventh member of a rapidly growing number of RRIO products

available from Texas Instruments and it is the first to allow operation up to 16-V rails with good ac performance.

The 2.7-V operation makes the TLV237x compatible with Li-Ion powered systems and the operating supply

voltage range of many micro-power microcontrollers available today including Texas Instruments’ MSP430.

SELECTION OF SIGNAL AMPLIFIER PRODUCTS

†

DEVICE V

(V)

(μV)

Iq/Ch

(μA)

(pA)

GBW

(MHz)

(V/μs)

SHUTDOWN

RAIL-

TO-

RAIL

SINGLES/DUALS/QUADS

TLV237x 2.7−16 500 550 1 3 2.4 Yes I/O S/D/Q

TLC227x 4−16 300 1100 1 2.2 3.6 — O D/Q

TLV27x 2.7−16 500 550 1 3 2.4 — O S/D/Q

TLC27x 3−16 1100 675 1 1.7 3.6 — — S/D/Q

TLV246x 2.7−6 150 550 1300 6.4 1.6 Yes I/O S/D/Q

TLV247x 2.7−6 250 600 2 2.8 1.5 Yes I/O S/D/Q

TLV244x 2.7−10 300 725 1 1.8 1.4 — O D/Q

†

Typical values measured at 5 V, 25°C

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Operational Amplifier

−

Summary of content (27 pages)

PAGE 1
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 D D D D D D D D D D Operational Amplifier Qualified for Automotive Applications Rail-To-Rail Input/Output Wide Bandwidth . . . 3 MHz High Slew Rate . . . 2.4 V/μs Supply Voltage Range . . . 2.7 V to 16 V Supply Current . . . 550 μA/Channel Input Noise Voltage . . . 39 nV/√Hz Input Bias Current . . . 1 pA Specified Temperature Range −40°C to 125°C . . .
PAGE 2
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 FAMILY PACKAGE TABLE{ PACKAGE TYPES} NUMBER OF CHANNELS SOIC TLV2371 1 TLV2372 2 TLV2374 4 DEVICE SOT-23 TSSOP MSOP 8 5 — — 8 — — 8 14 — 14 — UNIVERSAL EVM BOARD See the EVM Selection Guide (SLOU060) † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI we
PAGE 3
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 TLV237x PACKAGE PINOUTS(1) TLV2371 DBV PACKAGE (TOP VIEW) OUT 1 GND 2 IN+ 3 5 4 TLV2371 D PACKAGE (TOP VIEW) VDD NC IN − IN + GND 1 8 2 7 3 6 4 5 TLV2372 D OR DGK PACKAGE (TOP VIEW) NC VDD OUT NC 1OUT 1IN − 1IN + GND 1 8 2 7 3 6 4 5 VDD 2OUT 2IN − 2IN+ IN − TLV2374 D OR PW PACKAGE (TOP VIEW) 1OUT 1IN − 1IN+ VDD 2IN+ 2IN − 2OU
PAGE 4
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 5
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless otherwise noted) dc performance PARAMETER TEST CONDITIONS TA MIN 25°C VIO Input offset voltage αVIO Offset voltage drift VO = VDD/2 /2, VIC = VDD/2, /2 RS = 50 Ω VIC = 0 to VDD−1.35 1.35 V, RS = 50 Ω 7V VDD = 2 2.
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TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless otherwise noted) (continued) output characteristics PARAMETER TEST CONDITIONS VDD = 2 2.7 7V VIC = VDD/2, IOH = −1 1 mA VID = 1 V VDD = 5 V VDD = 15 V VOH High level output voltage High-level VDD = 2 2.
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TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless otherwise noted) (continued) dynamic performance PARAMETER UGBW Unity gain bandwidth TEST CONDITIONS RL = 2 kΩ, CL = 10 pF TA 2.
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TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 TYPICAL CHARACTERISTICS Table of Graphs FIGURE VIO Input offset voltage vs Common-mode input voltage CMRR Common-mode rejection ratio vs Frequency 4 Input bias and offset current vs Free-air temperature 5 VOL Low-level output voltage vs Low-level output current 6, 8, 10 VOH High-level output voltage vs High-level output current 7, 9, 11 VO(P
PAGE 9
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 TYPICAL CHARACTERISTICS INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 1000 800 600 400 200 0 1000 VDD = 5 V TA = 25 °C 800 600 400 200 0 −200 −200 0.4 0.8 1.2 1.6 2 0 VICR − Common-Mode Input Voltage − V 100 VDD = 5 V, 15 V 80 VDD = 2.
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TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 TYPICAL CHARACTERISTICS 12 TA =70°C 10 TA =25°C 8 TA =0°C 6 TA =−40°C 4 2 15 14 VDD = 15 V 12 TA = −40°C V O(PP) − Peak-to-Peak Output Voltage − V VDD = 15 V TA =125°C V OH − High-Level Output Voltage − V VOL − Low-Level Output Voltage − V 15 14 PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT
PAGE 11
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 TYPICAL CHARACTERISTICS SLEW RATE vs FREE-AIR TEMPERATURE PHASE MARGIN vs CAPACITIVE LOAD 3.5 3 100 SR− SR+ 1 AV = 1 RL = 10 kΩ CL = 50 pF TA = 25°C 0.5 8.5 10.5 12.5 SR+ 1.5 VDD = 5 V AV = 1 RL = 10 kΩ CL = 50 pF VI = 3 V 1 0 −40 −25 −10 5 14.
PAGE 12
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 TYPICAL CHARACTERISTICS INVERTING LARGE-SIGNAL RESPONSE VDD = 5 V AV = 1 RL = 2 kΩ CL = 10 pF VI = 3 VPP TA = 25°C 2 1 0 3 2 1 0 VO 0 2 4 6 8 10 12 14 12 9 VDD = 15 V AV = −1 RL = 2 kΩ CL = 10 pF VI = 9 Vpp TA = 25°C 6 3 0 6 3 0 16 0 2 4 6 8 10 12 14 16 t − Time − μs Figure 25 Figure 24 CROSSTALK vs FREQUENCY INVERTING SMALL-SIGNA
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TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 APPLICATION INFORMATION rail-to-rail input operation The TLV237x input stage consists of two differential transistor pairs, NMOS and PMOS, that operate together to achieve rail-to-rail input operation. The transition point between these two pairs can be seen in Figure 1 through Figure 3 for a 2.7-V, 5-V, and 15-V supply.
PAGE 14
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 APPLICATION INFORMATION general configurations When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier (see Figure 30).
PAGE 15
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 APPLICATION INFORMATION circuit layout considerations To achieve the levels of high performance of the TLV237x, follow proper printed-circuit board design techniques. The following is a general set of guidelines. D Ground planes—It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection.
PAGE 16
TLV2371-Q1, TLV2372-Q1, TLV2374-Q1 FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS SGLS244A − MAY 2004 − REVISED JUNE 2008 APPLICATION INFORMATION general power dissipation considerations For a given θJA, the maximum power dissipation is shown in Figure 32 and is calculated by the following formula: P D + Where: PD TMAX TA θJA ǒ T Ǔ –T MAX A q JA = Maximum power dissipation of TLV237x IC (watts) = Absolute maximum junction temperature (150°C) = Free-ambient air temperatur
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com (4) 26-Aug-2013 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
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PACKAGE MATERIALS INFORMATION www.ti.com 12-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TLV2371QDBVRQ1 SOT-23 DBV 5 3000 180.0 9.0 TLV2374QPWRG4Q1 TSSOP PW 14 2000 330.0 TLV2374QPWRQ1 TSSOP PW 14 2000 330.0 3.15 3.2 1.4 4.0 8.0 Q3 12.4 6.9 5.6 1.6 8.0 12.0 Q1 12.4 6.9 5.6 1.6 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 12-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2371QDBVRQ1 SOT-23 DBV 5 3000 182.0 182.0 20.0 TLV2374QPWRG4Q1 TSSOP PW 14 2000 367.0 367.0 35.0 TLV2374QPWRQ1 TSSOP PW 14 2000 367.0 367.0 35.
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