Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Op-amp Multi-purpose SOIC 8

www.ti.com

FEATURES DESCRIPTION

TLV2470 , , TLV2471

TLV2472 , TLV2473

TLV2474 , TLV2475 , TLV247xA

SLOS232E – JUNE 1999 – REVISED JULY 2007

FAMILY OF 600 μ A/Ch 2.8MHz RAIL-TO-RAIL INPUT/OUTPUT

HIGH-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN

• CMOS Rail-To-Rail Input/Output

The TLV247x is a family of CMOS rail-to-rail input/

output operational amplifiers that establishes a new

• Input Bias Current: 2.5pA

performance point for supply current versus ac

• Low Supply Current: 600 μ A/Channel

performance. These devices consume just

• Ultra-Low Power Shutdown Mode:

600 μ A/channel while offering 2.8MHz of

DD(SHDN)

: 350nA/ch at 3V

gain-bandwidth product. Along with increased ac

DD(SHDN)

: 1000nA/ch at 5V

performance, the amplifier provides high output drive

capability, solving a major shortcoming of older

• Gain-Bandwidth Product: 2.8MHz

micropower operational amplifiers. The TLV247x can

• High Output Drive Capability:

swing to within 180mV of each supply rail while

– ± 10mA at 180mV

driving a 10mA load. For non-RRO applications, the

TLV247x can supply ± 35mA at 500mV off the rail.

– ± 35mA at 500mV

Both the inputs and outputs swing rail-to-rail for

• Input Offset Voltage: 250 μ V (typ)

increased dynamic range in low-voltage applications.

• Supply Voltage Range: 2.7V to 6V

This performance makes the TLV247x family ideal

for sensor interface, portable medical equipment,

• Ultra-Small Packaging

and other data acquisition circuits.

– SOT23-5 or -6 (TLV2470/1)

– MSOP-8 or -10 (TLV2472/3)

FAMILY PACKAGE TABLE

PACKAGE TYPES

NUMBER OF

DEVICE SHUTDOWN UNIVERSAL EVM BOARD

CHANNELS

PDIP SOIC SOT23 TSSOP MSOP

TLV2470 1 8 8 6 — — Yes

TLV2471 1 8 8 5 — — —

TLV2472 2 8 8 — — 8 —

Refer to the EVM Selection

Guide (SLOU060 )

TLV2473 2 14 14 — — 10 Yes

TLV2474 4 14 14 — 14 — —

TLV2475 4 16 16 — 16 — Yes

A SELECTION OF SINGLE-SUPPLY OPERATIONAL AMPLIFIER PRODUCTS

(1)

BW SLEW RATE I

(per channel)

DEVICE OUTPUT DRIVE RAIL-TO-RAIL

(V) ( μ V) (MHz) (V/ μ s) ( μ A)

TLV247X 2.7 – 6.0 250 2.8 1.5 600 ± 35mA I/O

TLV245X 2.7 – 6.0 20 0.22 0.11 23 ± 10mA I/O

TLV246X 2.7 – 6.0 150 6.4 1.6 550 ± 90mA I/O

TLV277X 2.5 – 6.0 360 5.1 10.5 1000 ± 10mA O

(1) All specifications measured at 5V.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments.

Microsim PARTS is a trademark of MicroSim Corporation.

Microsim PSpice is a registered trademark of MicroSim Corporation.

All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (62 pages)

PAGE 1
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA ® ® www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 FAMILY OF 600μA/Ch 2.8MHz RAIL-TO-RAIL INPUT/OUTPUT HIGH-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN FEATURES • • • • • • • • • DESCRIPTION CMOS Rail-To-Rail Input/Output Input Bias Current: 2.5pA Low Supply Current: 600μA/Channel Ultra-Low Power Shutdown Mode: IDD(SHDN): 350nA/ch at 3V IDD(SHDN): 1000nA/ch at 5V Gain-Bandwidth Product: 2.
PAGE 2
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.
PAGE 4
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 DESCRIPTION (CONTINUED) Three members of the family (TLV2470/3/5) offer a shutdown terminal for conserving battery life in portable applications. During shutdown, the outputs are placed in a high-impedance state and the amplifier consumes only 350nA/channel. The family is fully specified at 3V and 5V across an expanded industrial temperature range (–40°C to +125°C).
PAGE 5
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 ELECTRICAL CHARACTERISTICS At specified free-air temperature, VDD = 3V, unless otherwise noted. PARAMETER TEST CONDITIONS TLV247x VIO Input offset voltage TLV247xA αVIO Temperature coefficient of input offset voltage IIO Input offset current TA (1) MIN +25°C 2400 +25°C 250 Full range High-level output voltage 25°C 1.
PAGE 6
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 ELECTRICAL CHARACTERISTICS (continued) At specified free-air temperature, VDD = 3V, unless otherwise noted. PARAMETER TEST CONDITIONS VDD = 2.
PAGE 7
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 ELECTRICAL CHARACTERISTICS At specified free-air temperature, VDD = 5V, unless otherwise noted.
PAGE 8
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 ELECTRICAL CHARACTERISTICS (continued) At specified free-air temperature, VDD = 5V, unless otherwise noted.
PAGE 9
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.
PAGE 10
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 TYPICAL CHARACTERISTICS INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 50 600 TA = +25° C 200 0 −200 −400 −600 −800 −0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VICR − Common-Mode Input Voltage − V 0 −200 −400 −600 30 IIB 20 10 0 IIO −10 −55 −35 −15 5 25 45 65 85 105 125 TA − Free-Air Temperature − °C −800 −0.5 0.5 1.5 2.5 3.5 4.5 5.5 VICR − Common-Mode Input Voltage − V Figure 2.
PAGE 11
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 TYPICAL CHARACTERISTICS (continued) POWER-SUPPLY REJECTION RATIO vs FREQUENCY TA = +125°C TA = +85°C 0.8 0.7 0.6 TA = +25°C 0.5 TA = −40°C 0.4 0.3 0.2 AV = 1 SHDN = VDD Per Channel 0.1 0.0 3.0 3.5 4.0 4.5 5.0 5.5 VDD − Supply Voltage − V 100 VDD = 3V, 5V RF = 5kΩ RI = 50Ω TA = +25°C PSRR+ 90 80 PSRR− 70 60 50 40 30 6.
PAGE 12
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 TYPICAL CHARACTERISTICS (continued) PHASE MARGIN vs LOAD CAPACITANCE 60 RNULL = 50 80 RNULL = 100 50 RNULL = 20 40 30 20 10 0 100 RNULL = 0 1k 10k CL − Load Capacitance − pF 40 30 10 15 RNULL = 20 RNULL = 20 25 RNULL = 50 RNULL = 0 1k 10k CL − Load Capacitance − pF 30 100 100k 1k 10k CL − Load Capacitance − pF Figure 19. Figure 20.
PAGE 13
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.
PAGE 14
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 TYPICAL CHARACTERISTICS (continued) 100 80 RL = 600Ω 60 RL = 10kΩ 40 20 0 1k 10k 100k f − Frequency − Hz 1M VDD = 3V, 5V RL = 10kΩ CL = 0pF AV = 1 VIN = 0.1VPP, 1.5VPP, 3VPP 20 100 1k 10k 100k f − Frequency − Hz 1M 2.0 1.8 1.6 1.4 TA = +125°C 1.2 TA = +85°C 1.0 TA = +25°C 0.8 TA = −40°C 0.6 0.4 Shutdown On RL = OPEN VI = VDD/2 0.2 0.0 10M 2.5 3.0 3.5 4.0 4.5 5.0 5.
PAGE 15
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 PARAMETER MEASUREMENT INFORMATION RNULL _ + RL CL Figure 41. APPLICATION INFORMATION DRIVING A CAPACITIVE LOAD When the amplifier is configured in this manner, capacitive loading directly on the output will decrease the device phase margin leading to high-frequency ringing or oscillations.
PAGE 16
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 APPLICATION INFORMATION (continued) GENERAL CONFIGURATIONS When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier (see Figure 44).
PAGE 17
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 APPLICATION INFORMATION (continued) Figure 35 and Figure 36 show the amplifier forward and reverse isolation in shutdown. The operational amplifier is powered by ±1.35V supplies and configured as a voltage follower (AV= 1). The isolation performance is plotted across frequency using 0.1VPP, 1.5VPP, and 2.5VPP input signals.
PAGE 18
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 APPLICATION INFORMATION (continued) DIE Side View (a) Thermal Pad DIE End View (b) Bottom View (c) The thermal pad is electrically isolated from all terminals in the package. Figure 46. Views of Thermally Enhanced DGN Package Although there are many ways to properly heatsink the PowerPAD package, the following steps illustrate the recommended approach. 1.
PAGE 19
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 APPLICATION INFORMATION (continued) MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 7 Maximum Power Dissipation − W 6 5 4 3 2 PWP Package Low-K Test PCB θJA = 29.7°C/W DGN Package Low-K Test PCB θJA = 52.
PAGE 20
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 APPLICATION INFORMATION (continued) TLV2470, TLV2471(1) MAXIMUM RMS OUTPUT CURRENT vs RMS OUTPUT VOLTAGE DUE TO THERMAL LIMITS 180 160 140 Packages With θJA ≤ 110°C/W at TA = +125°C or θJA ≤ 355°C/W at TA = +70°C C 120 100 B A 80 60 Safe Operating Area 40 VDD = ±3V 20 TJ = +150°C TA = +125°C 0 0 0.25 0.50 0.75 1.00 1.
PAGE 21
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.
PAGE 22
TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA www.ti.com SLOS232E – JUNE 1999 – REVISED JULY 2007 APPLICATION INFORMATION (continued) MACROMODEL INFORMATION Macromodel information provided was derived using Microsim PARTS™, the model generation software used with Microsim PSpice®. The Boyle macromodel and subcircuit in Figure 54 are generated using the TLV247x typical electrical and operating characteristics at TA = 25°C.
PAGE 23
PACKAGE OPTION ADDENDUM www.ti.
PAGE 24
PACKAGE OPTION ADDENDUM www.ti.
PAGE 25
PACKAGE OPTION ADDENDUM www.ti.
PAGE 26
PACKAGE OPTION ADDENDUM www.ti.
PAGE 27
PACKAGE OPTION ADDENDUM www.ti.
PAGE 28
PACKAGE OPTION ADDENDUM www.ti.
PAGE 29
PACKAGE OPTION ADDENDUM www.ti.
PAGE 30
PACKAGE OPTION ADDENDUM www.ti.
PAGE 31
PACKAGE OPTION ADDENDUM www.ti.com 31-Oct-2013 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production.
PAGE 32
PACKAGE OPTION ADDENDUM www.ti.
PAGE 33
PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLV2470AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2470CDBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2470CDBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.
PAGE 34
PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2012 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant PAD TLV2472CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2472IDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TLV2472IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2473AIDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.
PAGE 35
PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2470AIDR SOIC D 8 2500 340.5 338.1 20.6 TLV2470CDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TLV2470CDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TLV2470CDR SOIC D 8 2500 340.5 338.1 20.6 TLV2470IDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TLV2470IDBVT SOT-23 DBV 6 250 180.0 180.0 18.
PAGE 36
PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2012 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2473AIDR SOIC D 14 2500 367.0 367.0 38.0 TLV2473CDGQR MSOP-PowerPAD DGQ 10 2500 358.0 335.0 35.0 TLV2473CDGQR MSOP-PowerPAD DGQ 10 2500 364.0 364.0 27.0 TLV2473CDR SOIC D 14 2500 367.0 367.0 38.0 TLV2473IDGQR MSOP-PowerPAD DGQ 10 2500 358.0 335.0 35.0 TLV2474AIDR SOIC D 14 2500 367.0 367.0 38.
PAGE 37
PAGE 38
PAGE 39
PAGE 40
PAGE 41
PAGE 42
PAGE 43
PAGE 44
PAGE 45
PAGE 46
PAGE 47
PAGE 48
PAGE 49
PAGE 50
PAGE 51
PAGE 52
PAGE 53
PAGE 54
PAGE 55
PAGE 56
PAGE 57
PAGE 58
PAGE 59
PAGE 60
PAGE 61
PAGE 62
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.