Datasheet

 
  
    
SLOS197A − AUGUST1997 − REVISED MARCH 2001
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D Output Swing Includes Both Supply Rails
D Low Noise . . . 19 nV/Hz Typ at f = 1 kHz
D Low Input Bias Current ...1 pA Typ
D Fully Specified for Single-Supply 3-V and
5-V Operation
D Very Low Power ...110 µA Typ
D Common-Mode Input Voltage Range
Includes Negative Rail
D Wide Supply Voltage Range
2.7 V to 10 V
D Macromodel Included
description
The TLV2721 is a single low-voltage operational amplifier available in the SOT-23 package. It offers a
compromise between the ac performance and output drive of the TLV2731 and the micropower TLV2711.
It consumes only 150 µA (max) of supply current and is ideal for battery-powered applications. The device
exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The
TLV2721 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2721, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for
high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great
choice when interfacing with analog-to-digital converters (ADCs).
With a total area of 5.6mm
2
, the SOT-23 package only requires one third the board space of the standard 8-pin
SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal
source, minimizing noise pick-up from long PCB traces.
AVAILABLE OPTIONS
T
A
V
IO
max AT 25°C
PACKAGED DEVICES
SYMBOL
CHIP
FORM
T
A
V
IO
max AT 25
°
C
SOT-23 (DBV)
SYMBOL
FORM
(Y)
0°C to 70°C 3 mV TLV2721CDBV VAKC
TLV2721Y
−40°C to 85°C 3 mV TLV2721IDBV VAKI
TLV2721Y
The DBV package available in tape and reel only.
Chip forms are tested at T
A
= 25°C only.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV PACKAGE
(TOP VIEW)
5
43
1
2
IN+
V
DD+
OUT V
DD−
/GND
IN−
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Copyright 2001, Texas Instruments Incorporated
Advanced LinCMOS is a trademark of Texas Instruments.

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