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SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004

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D Rail-To-Rail Output

D Wide Bandwidth ...3 MHz

D High Slew Rate ...2 .4 V/µs

D Supply Voltage Range . . . 2.7 V to 16 V

D Supply Current . . . 550 µA/Channel

D Input Noise Voltage . . . 39 nV/√Hz

D Input Bias Current...1 pA

D Specified Temperature Range

0°C to 70°C . . . Commercial Grade

−40°C to 125°C . . . Industrial Grade

D Ultrasmall Packaging

− 5 Pin SOT-23 (TLV271)

− 8 Pin MSOP (TLV272)

D Ideal Upgrade for TLC27x Family

description

The TLV27x takes the minimum operating supply voltage down to 2.7 V over the extended industrial

temperature range while adding the rail-to-rail output swing feature. This makes it an ideal alternative to the

TLC27x family for applications where rail-to-rail output swings are essential. The TLV27x also provides 3-MHz

bandwidth from only 550 µA.

Like the TLC27x, the TLV27x is fully specified for 5-V and ±5-V supplies. The maximum recommended supply

voltage is 16 V, which allows the devices to be operated from a variety of rechargeable cells (±8 V supplies down

to ±1.35 V).

The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making

an attractive alternative for the TLC27x in battery-powered applications.

All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP,

and quads in the TSSOP package.

The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range

of many micropower microcontrollers available today including TI’s MSP430.

SELECTION OF SIGNAL AMPLIFIER PRODUCTS†

DEVICE

(V)

(µV)

Iq/Ch

(µA)

(pA)

GBW

(MHz)

(V/µs)

SHUTDOWN

RAIL-

TO-

RAIL

SINGLES/DUALS/QUADS

TLV27x 2.7−16 500 550 1 3 2.4 — O S/D/Q

TLC27x 3−16 1100 675 1 1.7 3.6 — — S/D/Q

TLV237x 2.7−16 500 550 1 3 2.4 Yes I/O S/D/Q

TLC227x 4−16 300 1100 1 2.2 3.6 — O D/Q

TLV246x 2.7−6 150 550 1300 6.4 1.6 Yes I/O S/D/Q

TLV247x 2.7−6 250 600 2 2.8 1.5 Yes I/O S/D/Q

TLV244x 2.7−10 300 725 1 1.8 1.4 — O D/Q

†

Typical values measured at 5 V, 25°C

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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Operational Amplifier

−

Summary of content (36 pages)

PAGE 1
µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 D D D D D D D D D D Rail-To-Rail Output Wide Bandwidth . . . 3 MHz High Slew Rate . . . 2 .4 V/µs Supply Voltage Range . . . 2.7 V to 16 V Supply Current . . . 550 µA/Channel Input Noise Voltage . . . 39 nV/√Hz Input Bias Current . . . 1 pA Specified Temperature Range 0°C to 70°C . . . Commercial Grade −40°C to 125°C . . .
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µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 FAMILY PACKAGE TABLE PACKAGE TYPES NUMBER OF CHANNELS PDIP SOIC TLV271 1 8 TLV272 2 8 TLV274 4 14 DEVICE SHUTDOWN SOT-23 TSSOP MSOP 8 5 — — — 8 — — 8 — 14 — 14 — — UNIVERSAL EVM BOARD Refer to the EVM Selection Guide (Lit# SLOU060) TLV271 AVAILABLE OPTIONS PACKAGED DEVICES VIOMAX AT 25°C TA 0°C to 70°C SOT-23 SMALL OUTLINE (D)† TLV271CD (DBV)‡
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µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 TLV27x PACKAGE PINOUTS(1) TLV271 D OR P PACKAGE (TOP VIEW) TLV271 DBV PACKAGE (TOP VIEW) OUT GND IN+ 1 5 VDD NC IN − IN + GND 2 3 4 IN − 1 8 2 7 3 6 4 5 VDD 2OUT 2IN − 2IN+ 8 2 7 3 6 4 5 NC VDD OUT NC TLV274 D, N, OR PW PACKAGE TLV272 D, DGK, OR P PACKAGE (TOP VIEW) 1OUT 1IN − 1IN + GND 1 (TOP VIEW) 1OUT 1IN − 1IN+ VDD 2IN+ 2IN − 2OUT 1 14 2 13 3
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µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and ±5 V (unless otherwise noted) dc performance PARAMETER VIO Input offset voltage αVIO Offset voltage drift TEST CONDITIONS VIC = VDD/2, RL = 10 kkΩ, kΩ, VO = VDD/2, RS = 50 Ω VIC = 0 to VDD−1.
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µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and ±5 V (unless otherwise noted) output characteristics PARAMETER TEST CONDITIONS VDD = 2.7 V VIC = VDD/2, IOH = −1 mA VOH MIN TYP 2.55 2.58 Full range 2.48 25°C 4.9 VDD = 5 V Full range 4.85 VDD = ±5 V 25°C 4.92 Full range 4.9 25°C 1.9 Full range 1.5 25°C 4.6 Full range 4.
PAGE 7
µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and ±5 V (unless otherwise noted) (continued) power supply PARAMETER IDD TEST CONDITIONS Supply current (per channel) VDD = 2.7 V VDD = 5 V VO = VDD/2 VDD = 10 V PSRR Supply voltage rejection ratio (∆VDD /∆VIO) VDD = 2.
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µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS Table of Graphs FIGURE CMRR Common-mode rejection ratio vs Frequency Input bias and offset current vs Free-air temperature 1 VOL VOH Low-level output voltage vs Low-level output current 3, 5, 7 High-level output voltage vs High-level output current 4, 6, 8 VO(PP) IDD Peak-to-peak output voltage vs Frequency 9 Supply current vs Supply voltag
PAGE 9
µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS 100 VDD = 5 V, 10 V 80 60 VDD = 2.7 V 40 20 0 10 100 1k 100 k 10 k 1M 250 VDD = 2.7 V, 5 V and 10 V VIC = VDD/2 200 150 100 50 0 −40 −25 −10 5 TA =−40°C TA = 125°C TA = 70°C TA = 25°C 0.80 TA = 0°C 0.40 TA = 125 °C 4.00 TA = 70 °C 3.50 3.00 2.50 TA = 25 °C 2.00 1.50 TA = 0 °C 1.00 TA = −40 °C 0.
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µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS POWER SUPPLY REJECTION RATIO vs FREQUENCY SUPPLY CURRENT vs SUPPLY VOLTAGE AV = 1 VIC = VDD / 2 I DD − Supply Current − mA/ch 0.9 PSRR − Power Supply Rejection Ratio − dB 1.0 TA = 125°C 0.8 TA = 70°C 0.7 0.6 0.5 0.4 TA = 25°C 0.3 TA = 0°C 0.2 TA = −40°C 0.1 0.0 120 TA = 25°C 100 VDD = 5 V, 10 V 80 VDD = 2.
PAGE 11
µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS VOLTAGE-FOLLOWER LARGE-SIGNAL PULSE RESPONSE VDD = 2.7, 5, 10 V TA = 25°C 90 4 80 70 60 50 3 2 1 VDD = 5 V AV = 1 RL = 2 kΩ CL = 10 pF VI = 3 VPP TA = 25°C VI 0 40 3 30 2 20 1 VO 10 0 0 100 1k 10 k f − Frequency − Hz 0 100 k 2 6 4 2 VO 0 0 2 4 6 8 0.12 0.08 VDD = 5 V AV = 1 RL = 2 kΩ CL = 10 pF VI = 100 mVPP TA = 25°C 0.
PAGE 12
µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS CROSSTALK vs FREQUENCY 0 0.00 VDD = 5 V AV = VI = −1 RL = 2 kΩ CL = 10 pF VI = 100 mVpp TA = 25°C −40 VI 0.10 VO 0.05 0.00 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Crosstalk − dB 0.05 VDD = 2.7, 5, & 15 V VI = 1 VDD/2 AV = 1 RL = 2 kΩ TA = 25°C −20 0.
PAGE 13
µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 APPLICATION INFORMATION offset voltage The output offset voltage, (VOO) is the sum of the input offset voltage (VIO) and both input bias currents (IIB) times the corresponding gains.
PAGE 14
µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 APPLICATION INFORMATION circuit layout considerations To achieve the levels of high performance of the TLV27x, follow proper printed-circuit board design techniques. A general set of guidelines is given in the following. D Ground planes—It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection.
PAGE 15
µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 APPLICATION INFORMATION general power dissipation considerations For a given θJA, the maximum power dissipation is shown in Figure 29 and is calculated by the following formula: P D + Where: ǒ T Ǔ –T MAX A q JA PD = Maximum power dissipation of TLV27x IC (watts) TMAX = Absolute maximum junction temperature (150°C) TA = Free-ambient air temperature (°C) θJA = θJC + θCA θJC =
PAGE 16
µ SLOS351D − MARCH 2001 − REVISED FEBRUARY 2004 APPLICATION INFORMATION macromodel information Macromodel information provided was derived using Microsim Parts Release 9.1, the model generation software used with Microsim PSpice . The Boyle macromodel (see Note 4) and subcircuit in Figure 30 are generated using TLV27x typical electrical and operating characteristics at TA = 25°C.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TLV271CDBVR SOT-23 DBV 5 3000 178.0 TLV271CDBVT SOT-23 DBV 5 250 TLV271CDR SOIC D 8 2500 TLV271IDBVR SOT-23 DBV 5 TLV271IDBVT SOT-23 DBV TLV272CDGKR VSSOP TLV272CDGKR VSSOP TLV272CDR B0 (mm) K0 (mm) P1 (mm) 9.0 3.23 3.17 1.37 4.0 178.0 9.0 3.23 3.17 1.37 330.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV271CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV271CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV271CDR SOIC D 8 2500 340.5 338.1 20.6 TLV271IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV271IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV272CDGKR VSSOP DGK 8 2500 358.0 335.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.