Datasheet

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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765

FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT

OPERATIONAL AMPLIFIERS WITH SHUTDOWN

SLOS326F − JUNE 2000 − REVISED AUGUST 2013

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D Low Supply Voltage . . . 1.8 V to 3.6 V

D Very Low Supply Current ...20 μA (per

channel)

D Ultralow Power Shut-Down Mode

− I

DD(SHDN)

= 10 nA/Channel

D CMOS Rail-to-Rail Input/Output

D Input Common-Mode Voltage

Range . . .

−0.2 V to V

+ 0.2 V

D Input Offset Voltage . . . 550 μV

D Wide Bandwidth...500 kHz

D Slew Rate . . . 0.20 V/μs

D Specified Temperature Range:

0°C to 70°C . . . Commercial Grade

−40°C to 85°C . . . Industrial Grade

D Ultrasmall Packaging

5 or 6 Pin SOT-23 (TLV2760/1)

8 or 10 Pin MSOP (TLV2762/3)

D Universal Op-Amp EVM

description

The TLV276x single supply operational amplifiers provide 500 kHz bandwidth from only 20 μA while operating

down to 1.8 V over the industrial temperature range. The maximum recommended supply voltage is 3.6 V, which

allows the devices to be operated from ("1.8 V supplies down to "0.9 V) two AA or AAA cells. The devices

have been characterized at 1.8 V (end of life of 2 AA(A) cells) and at 2.4 V (nominal voltage of 2 NiCd/NiMH

cells). The TLV276x have rail-to-rail input and output capability which is a necessity at 1.8 V.

The low supply current is coupled with extremely low input bias currents enabling them to be used with

mega-ohm resistors. Low shutdown current of only 10 nA make these devices ideal for low frequency

measurement applications desiring long active battery life.

All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP,

and quads in the TSSOP package.

SELECTION OF SINGLE SUPPLY AMPLIFIER PRODUCTS

DEVICE

(V)

(μV)

/Ch

(μA)

(pA)

GBW

(MHz)

(V/μs)

Vn,1kHz

(nV/√Hz

)

(mA)

SHUT-

DOWN

RAIL-TO-

RAIL

TLV224x 2.5 − 12 600 1 100 0.0055 0.002 NA 0.2 — I/O

TLV2211 2.7 − 10 450 13 1 0.065 0.025 21 0.4 — O

TLV276x 1.8 − 3.6 550 20 3 0.5 0.23 95 5 Y I/O

TLV245x(A) 2.7 − 6 20 23 500 0.22 0.11 49 2.5 Y I/O

TLV246x(A) 2.7 − 6 150 550 1300 6.4 1.6 11 25 Y I/O

TLV278x(A) 1.8 − 3.6 250 650 2.5 8 5 18 10 Y I/O

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Operational Amplifier

−

0 0.6 1.2 1.8 2.4 3 3.6

− Supply Voltage − V

SUPPLY CURRENT

SUPPLY VOLTAGE

I Supply Current − − Aμ

= 1

= V

DD/2

= 25° C

Summary of content (45 pages)

PAGE 1
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 D Low Supply Voltage . . . 1.8 V to 3.6 V D Very Low Supply Current . . . 20 μA (per D D D D D D D D − channel) Ultralow Power Shut-Down Mode − IDD(SHDN) = 10 nA/Channel CMOS Rail-to-Rail Input/Output Input Common-Mode Voltage Range . . . −0.2 V to VDD + 0.2 V Input Offset Voltage . . . 550 μV Wide Bandwidth . . .
PAGE 2
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.
PAGE 3
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.
PAGE 4
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 V Differential input voltage range, VID . . . . . . . . . . . . . . . . .
PAGE 5
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 electrical characteristics at recommended operating conditions, VDD = 1.8 V, 2.4 V (unless otherwise noted) dc performance PARAMETER VIO Input offset voltage αVIO Offset voltage drift TEST CONDITIONS VIC = VDD/2, VO = VDD/2, /2 RL = 300 kΩ, kΩ RS = 50 Ω TLV276x VICR = 0 V to VDD, RS = 50 Ω VDD = 2 2.4 4V VDD = 3 3.
PAGE 6
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 electrical characteristics at recommended operating conditions, VDD = 1.8 V, 2.4 V (unless otherwise noted) (continued) output characteristics PARAMETER TEST CONDITIONS VDD = 1 1.8V 8V VIC = VDD/2, IO OH = − 100 μA VDD = 2 2.4V 4V 6V VDD = 3 3.6V VOH High level output voltage High-level VDD = 1 1.
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 electrical characteristics at recommended operating conditions, VDD = 1.8 V, 2.4 V (unless otherwise noted) (continued) dynamic performance PARAMETER UGBW TA† TEST CONDITIONS Unity gain bandwidth RL = 300 kΩ , CL = 10 pF VDD = 1 1.
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 TYPICAL CHARACTERISTICS 300 350 VDD=1.8 V 250 TA=25° C VIO − Input Offset Voltage − μ V 200 150 100 50 0 −50 300 TA=25 °C 250 200 150 100 50 0 −50 −0.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VICR − Common-Mode Input Voltage − V VOL − Low-Level Output Voltage − V 1.4 TA=70°C 0.8 TA=25°C TA=0°C TA=−40°C 0.6 0.
PAGE 10
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 TYPICAL CHARACTERISTICS 20 16 TA = 85°C 14 TA = 25°C 12 TA = 0°C 10 TA = −40°C 8 6 TA = 70°C 4 VDD = 3.6 V 20 18 VDD = 2.4 V VDD = 1.
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 TYPICAL CHARACTERISTICS 0.32 0.28 SR+ 0.20 SR− 0.16 VDD = 1.8 V AV = 1 RL=300 kΩ CL=50 pF VIC = VDD/2 0.08 0.04 0.00 −40 −25 −10 5 20 35 50 65 SR− 0.20 0.16 0.12 VDD = 2.4 V AV = 1 RL= 300 kΩ CL = 50 pF VIC = VDD/2 0.08 0.04 0.00 −40 80 85 TA − Free-Air Temperature − °C −15 10 40 30 VDD = 2.
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 TYPICAL CHARACTERISTICS INVERTING SMALL-SIGNAL PULSE RESPONSE vs TIME 2 1.5 VI 1 0.5 0 2.5 VDD = 2.4 V AV = 1 RL = 300 kΩ CL = 10 pF TA = 25°C 2 1.5 VO 1 0.5 0 10 20 30 40 50 60 70 80 90 0 1.28 1.24 1.20 VI 1.16 VDD = 2.4 V RL = 300 kΩ CL = 10 pF AV = 1 TA = 25°C 1.
PAGE 13
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 TYPICAL CHARACTERISTICS V O − Output Voltage − V SHDN − Shutdown Pulse − V SHUTDOWN SUPPLY CURRENT / OUTPUT VOLTAGE vs TIME 3.0 2.5 2.0 1.5 1.0 0.5 0.0 −0.5 SHDN 1.5 1.3 1.0 0.8 VO 0.5 0.3 0.0 VDD = 2.4 V AV = 1 RL = 300 kΩ CL = 10 pF VIC = VDD/2 TA = 25° C I DD − Supply Current − μA −0.
PAGE 14
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 APPLICATION INFORMATION driving a capacitive load When the amplifier is configured in this manner, capacitive loading directly on the output will decrease the device’s phase margin leading to high frequency ringing or oscillations.
PAGE 15
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 APPLICATION INFORMATION general configurations (continued) RG RF VDD/2 − VO + VI R1 C1 f V O + V I ǒ 1) R R F G + –3dB Ǔǒ 1 2pR1C1 Ǔ 1 1 ) 2pfR1C1 Figure 33. Single-Pole Low-Pass Filter If even more attenuation is needed, a multiple pole filter is required.
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 APPLICATION INFORMATION circuit layout considerations (continued) D Sockets—Sockets can be used but are not recommended. The additional lead inductance in the socket pins will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board is the best implementation.
PAGE 17
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 APPLICATION INFORMATION general power dissipation considerations (continued) MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 2 Maximum Power Dissipation − W 1.75 PDIP Package Low-K Test PCB θJA = 104°C/W 1.5 1.25 SOIC Package Low-K Test PCB θJA = 176°C/W TJ = 150°C MSOP Package Low-K Test PCB θJA = 260°C/W 1 0.
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765 FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS326F − JUNE 2000 − REVISED AUGUST 2013 APPLICATION INFORMATION macromodel information Macromodel information provided was derived using Microsim Parts™ Release 9.1, the model generation software used with Microsim PSpice ™.
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Revision History DATE REV PAGE SECTION 8/2013 F 2 2nd Available Options Table DESCRIPTION Added TLVZ762CDGK and AJO to Available Options Table. NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 31-Oct-2013 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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PACKAGE MATERIALS INFORMATION www.ti.com 31-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TLV2760IDBVR SOT-23 DBV 6 3000 180.0 9.0 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.15 3.2 1.4 4.0 8.0 Q3 TLV2760IDBVT SOT-23 DBV 6 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TLV2761IDBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 31-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2760IDBVR SOT-23 DBV 6 3000 182.0 182.0 20.0 TLV2760IDBVT SOT-23 DBV 6 250 182.0 182.0 20.0 TLV2761IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0 TLV2761IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0 TLV2762CDGKR VSSOP DGK 8 2500 364.0 364.0 27.0 TLV2762CDR SOIC D 8 2500 340.5 338.1 20.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.