Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Comparator Multi-purpose CMOS, Push pull, Rail-to-rail, TTL SOT 23 8

V+

OUT A

OUT B

−

+IN A

−

IN A

+IN B

−

IN B

Propagation Delay (ns)

PROPAGATION DELAY vs OVERDRIVE VOLTAGE

0 10040 60 8020

Overdrive Voltage (mV)

Fall

Rise

= 1V

= 5V

LOAD

= 17pF

TLV3502-Q1

www.ti.com

SBOS507 –FEBRUARY 2010

4.5-ns RAIL-TO-RAIL HIGH-SPEED COMPARATOR

Check for Samples: TLV3502-Q1

FEATURES

DCN PACKAGE

• Qualified for Automotive Applications

(TOP VIEW)

• High Speed: 4.5 ns

• Rail-To-Rail I/O

• Supply Voltage: 2.7 V To 5.5 V

• Push-Pull CMOS Output Stage

• Shutdown (TLV3501 Only)

• Micro Package: SOT23-8

• Low Supply Current: 3.2 mA

APPLICATIONS

• Automatic Test Equipment

• Wireless Base Stations

• Threshold Detector

• Zero-Crossing Detector

• Window Comparator

DESCRIPTION

The TLV350x family of push-pull output comparators feature a fast 4.5-ns propagation delay and operation from

2.7 V to 5.5 V. Beyond-the-rails input common-mode range makes it an ideal choice for low-voltage applications.

The rail-to-rail output directly drives either CMOS or TTL logic.

A microsize package provides options for portable and space-restricted applications. The TLV3502 is available in

the SOT23-8 (DCN) package.

Table 1. TLV350x Related Products

FEATURES PRODUCT

Precision Ultra-Fast, Low-Power Comparator TLC3016

Differential Output Comparator TL712

High-Speed Op Amp, 16-Bit Accurate, 150MHz OPA300

High-Speed Op Amp, Rail-to-Rail, 38MHz OPA350

High-Speed Op Amp with Shutdown, 250MHz OPA357

ORDERING INFORMATION

(1)

PACKAGE

(2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

–40°C to 125°C SOT23-8 – DCN Reel of 3000 TLV3502AQDCNRQ1 3502

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (18 pages)

PAGE 1
TLV3502-Q1 www.ti.com SBOS507 – FEBRUARY 2010 4.5-ns RAIL-TO-RAIL HIGH-SPEED COMPARATOR Check for Samples: TLV3502-Q1 FEATURES 1 • • • • • • • • DCN PACKAGE (TOP VIEW) Qualified for Automotive Applications High Speed: 4.5 ns Rail-To-Rail I/O Supply Voltage: 2.7 V To 5.5 V Push-Pull CMOS Output Stage Shutdown (TLV3501 Only) Micro Package: SOT23-8 Low Supply Current: 3.
PAGE 2
TLV3502-Q1 SBOS507 – FEBRUARY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
TLV3502-Q1 www.ti.com SBOS507 – FEBRUARY 2010 ELECTRICAL CHARACTERISTICS TA = 25°C and VS = 2.7 V to 5.5 V (unless otherwise noted) Boldface limits apply over the specified temperature range, TA = −40°C to 125°C PARAMETER (1) TEST CONDITIONS MIN TYP MAX ±6.5 VOS Input offset voltage VCM = 0 V, IO = 0 mA ±1 ΔVOS/ΔT Offset voltage vs temperature TA = -40°C to 125°C ±5 PSRR Offset voltage vs power supply VS = 2.7 V to 5.
PAGE 4
TLV3502-Q1 SBOS507 – FEBRUARY 2010 www.ti.
PAGE 5
TLV3502-Q1 www.ti.com SBOS507 – FEBRUARY 2010 TYPICAL CHARACTERISTICS (continued) TA = 25°C, VS = 5 V, Input Overdrive = 100 mV (unless otherwise noted) PROPAGATION DELAY vs SUPPLY VOLTAGE (VCM = 1V, VOD = 20mV) WAKE−UP DELAY vs TEMPERATURE 110 9 Wake−Up Delay (ns) Propagation Delay (ns) 8 7 6 5 90 70 Fall 4 Rise 50 −40 −25 3 2 3 4 5 0 25 6 50 75 100 125 Temperature (°C ) Supply Voltage (V) RESPONSE TO 100MHz SINE WAVE (±2.
PAGE 6
TLV3502-Q1 SBOS507 – FEBRUARY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) TA = 25°C, VS = 5 V, Input Overdrive = 100 mV (unless otherwise noted) QUIESCENT CURRENT vs SHUTDOWN VOLTAGE QUIESCENT CURRENT vs FREQUENCY 3.5 25 CLOAD = 50pF Quiescent Current (mA) Quiescent Current (mA) 3.0 2.5 2.0 5V (from off to on) 2.7V (from off to on) 1.5 5V (from on to off) 1.0 2.7V (from on to off) 0.5 20 CLOAD = 20pF 15 10 CLOAD = 10pF 5 CLOAD = 0.
PAGE 7
TLV3502-Q1 www.ti.com SBOS507 – FEBRUARY 2010 APPLICATION INFORMATION The TLV350x feature high-speed response and includes 6 mV of internal hysteresis for improved noise immunity with an input common-mode range that extends 0.2 V beyond the power-supply rails. Shutdown A shutdown pin allows the device to go into idle when it is not in use. When the shutdown pin is high, the device draws about 2 mA and the output goes to high impedance. When the shutdown pin is low, the TLV3501 is active.
PAGE 8
TLV3502-Q1 SBOS507 – FEBRUARY 2010 www.ti.com Input Over-Voltage Protection Device inputs are protected by ESD diodes that will conduct if the input voltages exceed the power supplies by more than approximately 300 mV. Momentary voltages greater than 300 mV beyond the power supply can be tolerated if the input current is limited to 10 mA. This limiting is easily accomplished with a small input resistor in series with the comparator, as shown in Figure 3. VS 0.1µF R 2.
PAGE 9
TLV3502-Q1 www.ti.com SBOS507 – FEBRUARY 2010 VHI TLV3502a VIN VOUT SN74LVC1G02 TLV3502b VLO V VOUT VIN VHI VLO Time Figure 5. Window Comparator—Active High VLO TLV3502a VIN VOUT SN74AHC00 TLV3502b VHI V VOUT VIN VHI VLO Time Figure 6.
PAGE 10
TLV3502-Q1 SBOS507 – FEBRUARY 2010 www.ti.com PCB Layout For any high-speed comparator or amplifier, proper design and printed circuit board (PCB) layout are necessary for optimal performance. Excess stray capacitance on the active input, or improper grounding, can limit the maximum performance of high-speed circuitry. Minimizing resistance from the signal source to the comparator input is necessary in order to minimize the propagation delay of the complete circuit.
PAGE 11
TLV3502-Q1 www.ti.com SBOS507 – FEBRUARY 2010 −VIN SD VOUT RT2 RT1 DUT C1 C2 +VS GND +VIN Figure 8. TLV3501DBV (SOT23) Sample Layout +VS −VIN C1 100nF RT2 50Ω TLV3501 C2 2.2µF VOUT +VIN RT1 50Ω Shutdown Figure 9.
PAGE 12
PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) TLV3502AQDCNRQ1 ACTIVE Package Type Package Pins Package Drawing Qty SOT-23 DCN 8 3000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) CU NIPDAU Level-2-260C-1 YEAR (4) -40 to 125 3502 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.
PAGE 14
PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLV3502AQDCNRQ1 Package Package Pins Type Drawing SPQ SOT-23 3000 DCN 8 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 179.0 8.4 Pack Materials-Page 1 3.2 B0 (mm) K0 (mm) P1 (mm) 3.2 1.4 4.0 W Pin1 (mm) Quadrant 8.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV3502AQDCNRQ1 SOT-23 DCN 8 3000 195.0 200.0 45.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.