Datasheet

TLV61220

SLVSB53 –MAY 2012

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Layout Considerations

As for all switching power supplies, the layout is an important step in the design, especially at high peak currents

and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as

well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground

paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.

The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the

ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids

ground shift problems, which can occur due to superimposition of power ground current and control ground

current. Assure that the ground traces are connected close to the device GND pin.

THERMAL INFORMATION

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-

dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below.

• Improving the power-dissipation capability of the PCB design

• Improving the thermal coupling of the component to the PCB

• Introducing airflow in the system

For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal

Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).

Product Folder Link(s): TLV61220